Effect of neem gum on water sorption, biodegradability and mechanical properties of thermoplastic corn starch-based packaging films

IF 0.9 Q4 ENGINEERING, CHEMICAL
M. Anubha, R. Saranya, C. Chandrasatheesh, J. Jayapriya
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Abstract

ABSTRACT Cornstarch (CS) is an inexpensive and widely available material that can be easily moulded into thermoplastic starch (TPS) films when mixed with the plasticising agent glycerol (CS- Gly). However, its applications in the packaging sector are limited due to its brittleness and high-water solubility. To enhance the functional characteristics of the CS- Gly films in packaging applications, it was blended with neem gum at the concentrations of 0.3 and 0.9% (w/w). The tensile strength, elongation percentage, water sorption and biodegradability efficacy of the blended cornstarch films (CS-Gly-NG) were analysed. The tensile strength of the blended film improved by 1.1-fold compared with CS-Gly (24.49 ± 0.72 MPa) when the natural gum additive was used at 0.30% (w/w). However, once the natural gum content was raised to 0.9% (w/w), the TS of the film decreased to 21.28 ± 1.75 MPa, whereas the resistance to water solubility improved to a greater extent. Moreover, the biodegradability test showed that the blended films (64-69 wt %) disintegrated more rapidly than the CS-Gly film (17.3%) in a setting akin to the natural environment. Therefore, this blended film (CS-Gly-NG) can be used as an alternative to the commercially available non-biodegradable polyethene films and will have a positive impact on the environment. GRAPHICAL ABSTRACT
印楝胶对热塑性玉米淀粉基包装膜吸水性、生物降解性和力学性能的影响
玉米淀粉(CS)是一种价格低廉、用途广泛的材料,当与增塑剂甘油(CS-Gly)混合时,可以很容易地成型为热塑性淀粉(TPS)膜。然而,由于其脆性和高水溶性,其在包装领域的应用受到限制。为了增强CS-Gly薄膜在包装应用中的功能特性,将其与印楝胶以0.3%和0.9%(w/w)的浓度共混。分析了玉米淀粉共混膜(CS-Gly-NG)的拉伸强度、伸长率、吸水性和生物降解性能。与CS Gly相比,共混膜的拉伸强度提高了1.1倍(24.49 ± 0.72 MPa)。然而,一旦天然树胶含量提高到0.9%(w/w),薄膜的TS就降低到21.28 ± 1.75 MPa,而抗水溶性得到了更大程度的改善。此外,生物降解性测试表明,在类似于自然环境的环境中,共混膜(64-69wt%)比CS-Gly膜(17.3%)分解得更快。因此,这种共混膜(CS-Gly-NG)可以用作市售的不可生物降解的聚乙烯膜的替代品,并且将对环境产生积极影响。图形摘要
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Indian Chemical Engineer
Indian Chemical Engineer ENGINEERING, CHEMICAL-
CiteScore
3.00
自引率
6.70%
发文量
33
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