Evaluation of crack opening phenomenon using subset-optimized digital image correlation

IF 2.1 3区 工程技术 Q2 ENGINEERING, CIVIL
M. Kang, S. Im, Y. An
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引用次数: 0

Abstract

This paper presents crack opening phenomenon evaluation using digital image correlation (DIC) with a statistically optimized subset size. In conventional DIC analysis, the subset sizes varying from several pixels to more than hundred pixels have been often selected by experts' subjective judgement based on conventional subset size determination algorithms. Since these conventional subset size determination algorithms, however, calculate speckle pattern features at a certain location of a single target image, it is difficult to consider not only all speckle pattern features within region of interest (ROI) but also the random measurement noises during the digital image acquisition process. To overcome the technical limitation, a statistical optimization algorithm of the subset size, which calculates the optimal subset size by the 3-loop iteration of normalized cross correlation within the entire ROI, is newly proposed. In addition, the optimal subset-based DIC analysis is applied to crack opening phenomenon evaluation in a mock-up concrete specimen under step loading conditions. The validation test results show 3.6 μm maximum error compared with the ground truth which is obtained by direct measurement, while a conventional subset size determination algorithm-based DIC analysis produces the maximum error of 62.7 μm.
基于子集优化数字图像相关的裂纹打开现象评价
本文提出了使用具有统计优化子集大小的数字图像相关(DIC)来评估裂纹张开现象。在传统的DIC分析中,通常通过专家基于传统子集大小确定算法的主观判断来选择从几个像素到一百多个像素不等的子集大小。然而,由于这些传统的子集大小确定算法计算单个目标图像的特定位置处的散斑图案特征,因此在数字图像采集过程中,不仅难以考虑感兴趣区域(ROI)内的所有散斑图案特征,而且难以考虑随机测量噪声。为了克服技术限制,新提出了一种子集大小的统计优化算法,该算法通过在整个ROI内进行归一化互相关的3循环迭代来计算最优子集大小。此外,将基于最优子集的DIC分析应用于阶梯加载条件下实体混凝土试件的裂缝张开现象评估。验证测试结果显示,与直接测量获得的地面实况相比,最大误差为3.6μm,而基于DIC分析的传统子集大小确定算法产生的最大误差为62.7μm。
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来源期刊
Smart Structures and Systems
Smart Structures and Systems 工程技术-工程:机械
CiteScore
6.50
自引率
8.60%
发文量
0
审稿时长
9 months
期刊介绍: An International Journal of Mechatronics, Sensors, Monitoring, Control, Diagnosis, and Management airns at providing a major publication channel for researchers in the general area of smart structures and systems. Typical subjects considered by the journal include: Sensors/Actuators(Materials/devices/ informatics/networking) Structural Health Monitoring and Control Diagnosis/Prognosis Life Cycle Engineering(planning/design/ maintenance/renewal) and related areas.
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