R. Krishna, Rui Zhang, Siddharth Ravichandran, T. Fan, A. Hosseinnia, Jose Lopez-Ninantay, Fuhan Liu, M. Kathaperumal, Madhavan Swaminathan, A. Adibi
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引用次数: 0
Abstract
Abstract. An on-package optical interconnect design is proposed for the first time, with silicon photonics in conjunction with the polymer-on-glass interposer technology to enable heterogeneous integration. Glass substrates are used for low-cost, high reliability packaging while silicon photonics allows for high-speed modulation and wavelength division multiplexing within a small footprint. By combining silicon-photonic and benzo-cyclobutene-on-glass interposer technologies, we propose a scalable on-package photonic interconnect that can provide data rates >224 Gb / s for medium-reach links. Our proposed interconnect considers microring modulators and high-speed detectors available in photonic-foundry processes. We present the power-budget analysis to identify the key limiting parameters toward achieving an energy consumption of < 1 pJ / bit.
期刊介绍:
The Journal of Nanophotonics publishes peer-reviewed papers focusing on the fabrication and application of nanostructures that facilitate the generation, propagation, manipulation, and detection of light from the infrared to the ultraviolet regimes.