Effect of Electric Current-assisted Application of Adhesives on their Bond Strength and Quality.

IF 2.5 3区 医学 Q2 DENTISTRY, ORAL SURGERY & MEDICINE
Maurício Bottene Guarda, Paolo Tulio Di Nizo, Gabriel Flores Abuna, Anderson Catelan, Mário Alexandre Coelho Sinhoreti, Rafael Pino Vitti
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引用次数: 10

Abstract

Purpose: To assess the effect of the application of different electric currents on dentin bonding and resin infiltration of self-etching and etch-and-rinse adhesives.

Materials and methods: Two hundred four sound third molars were selected and divided in groups according to the adhesive (self-etch [CSE, Clearfil SE Bond, Kuraray Noritake], universal [SBU, Single Bond Universal, 3M Oral Care], and etch-and-rinse [SB2, Adper Single Bond 2 (SB2), 3M Oral Care]) and electrical current used (0, 5, 10, 15, 20, 25, 30, and 35 μA). Light curing was performed for 10 s with an LED-curing unit at 1000 mW/cm2. Composite blocks were constructed of nanofilled composite in increments of 2 mm, which were light cured for 20 s. Specimens were sectioned into sticks with a cross-sectional area of ~1 mm2 and stored in distilled water at 37°C for 24 h. Microtensile bond strength (μTBS) testing (n = 8) was performed using a universal testing machine at a crosshead speed of 0.5 mm/min until failure. The bonding quality (n = 2) of adhesives applied with or without 35-μA electric current was evaluated using confocal laser scanning microscopy. Bond strengths were analyzed with two-way ANOVA and Tukey's test (α = 0.05).

Results: CSE presented the highest μTBS for all electrical currents tested. For CSE and SBU, electrical currents from 0-20 μA showed the lowest μTBS. Electrical currents from 0-10 and 20-25 μA yielded the lowest μTBS for SB2. CSE and SB2 applied under 35 μA showed a greater number of resin tags in dentin tubules. Fluorescein penetration into the hybrid layer was found for SBU applied without electric current.

Conclusion: The application of adhesives using 35-μA electric current improved the bond strength and quality of the adhesive interface.

电流辅助胶粘剂应用对their粘结强度和质量的影响。
目的:探讨不同电流对自蚀刻和蚀刻-冲洗胶粘剂牙本质粘接和树脂渗透的影响。材料和方法:选择健康第三磨牙240颗,根据使用的黏合剂(自蚀刻[CSE, Clearfil SE Bond, Kuraray Noritake]、通用[SBU, Single Bond universal, 3M Oral Care]、蚀刻冲洗[SB2, Adper Single Bond 2 (SB2), 3M Oral Care])和使用的电流(0、5、10、15、20、25、30、35 μA)进行分组。用led光固化装置在1000 mW/cm2下光固化10 s。将纳米填充的复合材料以2 mm的增量构建复合块,光固化20 s。将试样切成横截面积为~1 mm2的棒状,在37℃蒸馏水中保存24 h。在万能试验机上以0.5 mm/min的十字速度进行微拉伸粘结强度(μTBS)测试(n = 8),直至失效。用激光共聚焦扫描显微镜观察35 μ a电流下和未施加35 μ a电流时胶粘剂的粘接质量(n = 2)。结合强度分析采用双因素方差分析和Tukey检验(α = 0.05)。结果:CSE对所有电流的μTBS均最高。对于CSE和SBU, 0 ~ 20 μA的电流表现出最低的μTBS。0 ~ 10 μA和20 ~ 25 μA的电流对SB2产生最低的μTBS。在35 μA下,CSE和SB2在牙本质小管中显示出更多的树脂标签。在没有电流的情况下,发现荧光素渗透到杂化层中。结论:在35 μ a电流下应用胶粘剂,可提高粘接界面的粘接强度和粘接质量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Adhesive Dentistry
Journal of Adhesive Dentistry 医学-牙科与口腔外科
CiteScore
5.20
自引率
6.10%
发文量
44
审稿时长
6-12 weeks
期刊介绍: New materials and applications for adhesion are profoundly changing the way dentistry is delivered. Bonding techniques, which have long been restricted to the tooth hard tissues, enamel, and dentin, have obvious applications in operative and preventive dentistry, as well as in esthetic and pediatric dentistry, prosthodontics, and orthodontics. The current development of adhesive techniques for soft tissues and slow-releasing agents will expand applications to include periodontics and oral surgery. Scientifically sound, peer-reviewed articles explore the latest innovations in these emerging fields.
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