Crystal structure of a Cu(II) complex with a bridging ligand: poly[[penta-kis-[μ2-1,1'-(butane-1,4-di-yl)bis-(1H-imidazole)-κ(2) N (3):N (3')]dicopper(II)] tetranitrate tetra-hydrate].

IF 0.9
Fayuan Wu, Mengxiang Shang, Shihua Li, Yu Zhao
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引用次数: 0

Abstract

A novel two-dimensional→three-dimensional Cu(II) coordination polymer, {[Cu2(C10H14N4)5](NO3)4·4H2O} n , based on the 1,1'-(butane-1,4-di-yl)bis-(1H-imidazole) (biim) ligand and containing one crystallographically unique Cu(II) atom, has been synthesized under hydro-thermal conditions. The Cu(II) atom is coordinated by five N atoms from biim ligands, one of which has crystallographically imposed inversion symmetry, giving rise to a slightly distorted CuN5 square-pyramidal geometry. The Cu(II) cations are linked by biim ligands to give a 4(4) layer; the layers are further bridged by biim ligands, generating a double sheet with a thickness of 14.61 Å. The sheet features rhombic Cu4(biim)4 windows built up from four Cu(II) centers and four biim ligands with dimensions of 14.11 × 14.07 Å(2). Each window of a layer is penetrated directly by the biim ligand of the adjacent net, giving a two-dimensional→three-dimensional entangled framework.

Abstract Image

Abstract Image

Abstract Image

具有桥接配体的 Cu(II) 复合物的晶体结构:聚[[五-双-[μ2-1,1'-(丁烷-1,4-二基)双-(1H-咪唑)-κ(2) N (3):N (3')]二氯化铜(II)]四水合物]。
在水热条件下合成了一种新型二维→三维 Cu(II)配位聚合物 {[Cu2(C10H14N4)5](NO3)4-4H2O} n,它以 1,1'-(丁烷-1,4-二基)双(1H-咪唑)(biim)配体为基础,含有一个晶体学上独特的 Cu(II)原子。Cu(II)原子由来自双(biim)配体的五个 N 原子配位,其中一个 N 原子具有晶体学上的反转对称性,从而形成了略微扭曲的 CuN5 方斜几何形状。Cu(II)阳离子通过双原子配体连接成一个 4(4) 层;双原子配体进一步桥接各层,形成厚度为 14.61 Å 的双层薄片。薄片上的菱形 Cu4(biim)4 窗口由四个 Cu(II) 中心和四个 biim 配体构成,尺寸为 14.11 × 14.07 Å(2)。一层的每个窗口都直接被相邻网的生物配体穿透,从而形成一个二维→三维的纠缠框架。
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来源期刊
自引率
33.30%
发文量
0
审稿时长
1.3 months
期刊介绍: Acta Crystallographica Section E: Structure Reports Online is the IUCr highly popular open-access structural journal. It provides a simple and easily accessible publication mechanism for the growing number of inorganic, metal-organic and organic crystal structure determinations. The electronic submission, validation, refereeing and publication facilities of the journal ensure very rapid and high-quality publication, whilst key indicators and validation reports provide measures of structural reliability. In 2009, the journal published over 4000 structures. The average publication time is less than one month.
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