Shear bond strength comparison of a conventional and a self-etching fluoride-releasing adhesive following thermocycling.

World journal of orthodontics Pub Date : 2010-01-01
Oral Sökücü, Şeyda Hergüner Siso, Özden Özel Bektaş, Hasan Babacan
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Abstract

Aim: To compare the effect of thermocycling on the shear bond strength of brackets bonded using different primers.

Methods: One hundred twenty extracted defect-free premolars were randomly divided into three groups. In all three, Transbond XT was the bonding adhesive of choice. In the control group (I), the standard Transbond primer was used, in group II a fluoride-releasing primer (Reliance fluoride containing light cure bond), and in group III an antimicrobial fluoride-releasing self-etching primer (Clearfil Protect Bond). These three groups were divided into two subgroups of 20 teeth each. In the first subgroups, the teeth were stored in only distilled water for 24 hours, whereas in the second subgroups, they were thermocycled 500 times between 5 degrees C and 55 degrees C. The shear bond strength was determined with a universal testing machine. After bracket failure, the Adhesive Remnant Index (ARI) score was verified. The data were analyzed using two-way analysis of variance, Bonferroni, and chi-square tests.

Results: The group with the antimicrobial fluoride-releasing self-etching primer had a significantly lower shear bond strength than all other groups (P<.05). Thermocycling reduced the shear bond strength in all groups considerably.

Conclusion: The antimicrobial fluoride-releasing self-etching primer performed comparably worse regardless of thermocycling. Brackets attached with self-etching primers demonstrated a shear bond strength after thermocycling approaching the border of acceptable adhesion. Thermocycling changed the ARI scores of the self-etching primer groups from the bracket-adhesive to the enamel-adhesive interface.

热循环后常规和自蚀刻释氟胶的剪切强度比较。
目的:比较热循环对不同底漆粘结支架剪切强度的影响。方法:120颗拔除的无缺损前磨牙随机分为3组。在这三种粘合剂中,Transbond XT是首选的粘合剂。在对照组(I)中,使用标准的Transbond引物,在II组中使用释放氟的引物(Reliance含氟光固化键),在III组中使用抗菌释放氟的自蚀蚀引物(Clearfil保护键)。这三个组又分成两个亚组,每组20颗牙齿。第一亚组仅在蒸馏水中保存24小时,第二亚组在5℃至55℃之间进行500次热循环,剪切粘接强度用万能试验机测定。在支架失效后,验证粘接残余指数(ARI)评分。采用双向方差分析、Bonferroni检验和卡方检验对数据进行分析。结果:抗菌氟释放自蚀刻引物组的剪切结合强度明显低于其他各组(p)。结论:无论热循环如何,抗菌氟释放自蚀刻引物的剪切结合强度均较差。带有自蚀刻底漆的支架在热循环接近可接受的粘合边界后显示出剪切粘合强度。热循环改变了自蚀刻底漆基团的ARI分数,从支架-粘合剂到搪瓷-粘合剂界面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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