Electroforming technique.

A J Raigrodski, C Malcamp, W A Rogers
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引用次数: 0

Abstract

Electroforming technology is used to form substructures for porcelain inlays and crowns. This technique may be used as an alternative to the currently available porcelain-fused-to-metal and all-ceramic systems. Composed of pure 24 K gold deposited directly onto a duplicate die, electroformed copings are relatively thin (0.2 mm), highly biocompatible, and present a marginal accuracy of 20 microns on average. The equipment is relatively easy to use and therefore makes this technique attractive to small ceramics laboratories. The esthetic advantages of a gold colored substructure, the reduced thickness of the coping, and the improved fit of the gold collar when it is used, present a restorative alternative to the dentist, to the ceramist, and to the patient.

电铸技术。
电铸技术用于形成瓷镶嵌体和瓷冠的子结构。该技术可作为替代目前可用的瓷熔金属和全陶瓷系统。电铸覆层由纯24k金直接沉积在一个重复的模具上,相对较薄(0.2毫米),具有高度的生物相容性,并且平均呈现20微米的边缘精度。该设备相对容易使用,因此使该技术对小型陶瓷实验室具有吸引力。金色底座结构的美学优势,减少了顶部的厚度,并且在使用时改善了金环的配合度,为牙医,陶艺师和患者提供了一种修复选择。
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