[Isothermal ordering process and order-hardening in CuPd alloys (author's transl)].

T Shiraishi
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引用次数: 0

Abstract

The isothermal ordering process in CuPd alloys containing 34.74 approximately 50.22 at % Pd was investigated by means of electrical resistivity measurements, X-ray diffraction, metallographic observations and hardness tests. The ordering mechanism and the order-hardening mechanism were discussed. Ordering in the alloys which are in the region of beta (ordered) single phase in equilibrium phase diagram, apparently occurred through single process, and the ordering rate was very high. On the other hand, ordering occurred through two processes (stage I and II) in the case of the alloys in which ordered and disordered phases, i.e. beta and alpha phases coexist, and the ordering rate was low. Ordering was attained by discontinuous ordering mechanism in both regions. Considering the value of activation energy for ordering and results of metallographic observations, it is suggested that the ordering is attained by grain boundary diffusion both in the beta single phase region and in stage II of the (alpha + beta) two phased region. It can be also interpreted that the order-hardening in these alloys is attributed to the increase of volume fraction of beta phase in both regions.

CuPd合金的等温有序过程和有序硬化(作者简介)。
采用电阻率测量、x射线衍射、金相观察和硬度测试等方法研究了含34.74 ~ 50.22 (% Pd)的CuPd合金的等温有序过程。讨论了有序机理和有序硬化机理。在平衡相图中处于β(有序)单相区的合金,其有序过程明显是通过单一过程发生的,且有序率很高。而有序相和无序相并存的合金,即α相和β相,则通过两个阶段(阶段I和阶段II)进行有序,有序率较低。通过不连续排序机制对两个区域进行排序。结合有序活化能值和金相观察结果,认为有序是在β单相区和(α + β)两相区的第II阶段通过晶界扩散实现的。这也可以解释为合金的有序硬化是由于这两个区域β相体积分数的增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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