Dynamic Current-Sharing Model for Multichip Parallel MOSFETs with Common-Source Structure

IF 4 Q1 Engineering
Chinese Journal of Electrical Engineering Pub Date : 2026-06-01 Epub Date: 2026-04-23 DOI:10.23919/CJEE.2025.000159
Xu Yang;Haixiao Zheng;Jin Zhu;Minghao Wang;Yu Lei
{"title":"Dynamic Current-Sharing Model for Multichip Parallel MOSFETs with Common-Source Structure","authors":"Xu Yang;Haixiao Zheng;Jin Zhu;Minghao Wang;Yu Lei","doi":"10.23919/CJEE.2025.000159","DOIUrl":null,"url":null,"abstract":"With the gradual popularization of integrated modules of parallel chips, current sharing has become a key research direction in meeting increasingly stringent performance requirements. Most existing current-sharing methods focus on the half-bridge structure of parallel chips, which is not applicable to common-source power modules with bidirectional turn-on and turn-off capability. A current-sharing method is proposed for multi-chip parallel metal-oxide-semiconductor field-effect transistors (MOSFETs) in a common-source structure and a current-sharing criterion is introduced for MOSFETs in a common-source connection, which improves current balancing in package modeling by suppressing the circulating current between chips in an asymmetric layout. This study models the MOSFET common-source power module, abstracts the package parasitic parameter variation scenarios in different layouts, and extracts the parasitic inductance for the simulation. The simulation results verified the validity of the proposed current-sharing criterion. A MOSFET power module is fabricated and double-pulse-tested to verify its on-off capability. This study provides a basis for improving the current-sharing capability of parallel devices, and offers new insights into the design and optimization of power module packages.","PeriodicalId":36428,"journal":{"name":"Chinese Journal of Electrical Engineering","volume":"12 2","pages":"210-221"},"PeriodicalIF":4.0000,"publicationDate":"2026-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11494202","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Chinese Journal of Electrical Engineering","FirstCategoryId":"1087","ListUrlMain":"https://ieeexplore.ieee.org/document/11494202/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/4/23 0:00:00","PubModel":"Epub","JCR":"Q1","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0

Abstract

With the gradual popularization of integrated modules of parallel chips, current sharing has become a key research direction in meeting increasingly stringent performance requirements. Most existing current-sharing methods focus on the half-bridge structure of parallel chips, which is not applicable to common-source power modules with bidirectional turn-on and turn-off capability. A current-sharing method is proposed for multi-chip parallel metal-oxide-semiconductor field-effect transistors (MOSFETs) in a common-source structure and a current-sharing criterion is introduced for MOSFETs in a common-source connection, which improves current balancing in package modeling by suppressing the circulating current between chips in an asymmetric layout. This study models the MOSFET common-source power module, abstracts the package parasitic parameter variation scenarios in different layouts, and extracts the parasitic inductance for the simulation. The simulation results verified the validity of the proposed current-sharing criterion. A MOSFET power module is fabricated and double-pulse-tested to verify its on-off capability. This study provides a basis for improving the current-sharing capability of parallel devices, and offers new insights into the design and optimization of power module packages.
共源结构多片并联mosfet的动态电流共享模型
随着并行芯片集成模块的逐步普及,电流共享已成为满足日益严格的性能要求的重点研究方向。现有的电流共享方法大多集中在并联芯片的半桥结构上,不适用于具有双向通断能力的共源功率模块。提出了一种多芯片并联金属氧化物半导体场效应晶体管(mosfet)共源结构的电流共享方法,并引入了一种用于mosfet共源连接的电流共享准则,通过抑制非对称布局中芯片之间的循环电流,改善了封装建模中的电流平衡。本研究对MOSFET共源功率模块进行建模,抽象出不同布局下封装寄生参数的变化情况,并提取寄生电感进行仿真。仿真结果验证了所提电流分担准则的有效性。制作了一个MOSFET功率模块并进行了双脉冲测试以验证其通断能力。该研究为提高并联器件的电流共享能力提供了基础,并为电源模块封装的设计和优化提供了新的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Chinese Journal of Electrical Engineering
Chinese Journal of Electrical Engineering Energy-Energy Engineering and Power Technology
CiteScore
7.80
自引率
0.00%
发文量
621
审稿时长
12 weeks
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信
小红书