Enhancing the Functional Characteristics of Cast Parts Produced by Additive Technologies through Surface Roughness Reduction Using Electrochemical Polishing

IF 0.8 4区 物理与天体物理 Q4 PHYSICS, APPLIED
N. F. Kashapov, M. R. Fazlyev, I. F. Timerbaev, L. N. Kashapov
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引用次数: 0

Abstract

The objective of this work is to reduce the surface roughness parameters (Ra, Rz) of nickel-based alloy turbine blades, manufactured by investment casting using a 3D-printed polystyrene pattern, to the levels required by technical documentation through electrochemical polishing (ECP). Initial and final roughness values were measured with a contact profilometer “Model 130 (Version 7)” in accordance with GOST 2789-73; notations follow GOST ISO 1302. It is demonstrated that ECP ensures a significant reduction of Ra and Rz on both the concave and convex blade surfaces, including cases with preliminary blasting. The treatment was performed locally, without full immersion: only the required surface areas were polished. The influence of the obtained roughness values on the aerohydrodynamic efficiency of the flow section is discussed, as well as the applicability of ECP as a preparatory stage for functional coatings.

通过电化学抛光降低表面粗糙度来增强增材制造铸件的功能特性
这项工作的目的是通过电化学抛光(ECP),将镍基合金涡轮叶片的表面粗糙度参数(Ra, Rz)降低到技术文件要求的水平。镍基合金涡轮叶片是用3d打印聚苯乙烯图案进行熔模铸造制造的。根据GOST 2789-73,使用“130型(版本7)”接触式轮廓仪测量初始和最终粗糙度值;符号遵循GOST ISO 1302。结果表明,ECP可确保叶片凹面和凸面上Ra和Rz的显著降低,包括初步爆破的情况。处理是局部进行的,没有完全浸泡:只抛光所需的表面区域。讨论了得到的粗糙度值对流段气动效率的影响,以及ECP作为功能涂层准备阶段的适用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Technical Physics Letters
Technical Physics Letters 物理-物理:应用
CiteScore
1.50
自引率
0.00%
发文量
44
审稿时长
2-4 weeks
期刊介绍: Technical Physics Letters is a companion journal to Technical Physics and offers rapid publication of developments in theoretical and experimental physics with potential technological applications. Recent emphasis has included many papers on gas lasers and on lasing in semiconductors, as well as many reports on high Tc superconductivity. The excellent coverage of plasma physics seen in the parent journal, Technical Physics, is also present here with quick communication of developments in theoretical and experimental work in all fields with probable technical applications. Topics covered are basic and applied physics; plasma physics; solid state physics; physical electronics; accelerators; microwave electron devices; holography.
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