{"title":"The Adhesive Capacity of Corundum Ceramics Regulated by Low-Pressure CCP Plasma","authors":"I. K. Nekrasov, I. Sh. Abdullin","doi":"10.1134/S1063785026600365","DOIUrl":null,"url":null,"abstract":"<p>A comprehensive study was conducted on the effect of plasma treatment under conditions of a high-frequency low-pressure discharge on the physical and mechanical characteristics of technical corundum ceramics. The main goal of the study was to modify the surface and strength properties of the material. It was experimentally determined that plasma treatment significantly improves the key parameters of the material. In particular, there was a significant decrease in the contact angle of water wetting from 83° to 21°, indicating an increase in the surface energy of the material.</p>","PeriodicalId":784,"journal":{"name":"Technical Physics Letters","volume":"52 3","pages":"133 - 135"},"PeriodicalIF":0.8000,"publicationDate":"2026-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Technical Physics Letters","FirstCategoryId":"101","ListUrlMain":"https://link.springer.com/article/10.1134/S1063785026600365","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"PHYSICS, APPLIED","Score":null,"Total":0}
引用次数: 0
Abstract
A comprehensive study was conducted on the effect of plasma treatment under conditions of a high-frequency low-pressure discharge on the physical and mechanical characteristics of technical corundum ceramics. The main goal of the study was to modify the surface and strength properties of the material. It was experimentally determined that plasma treatment significantly improves the key parameters of the material. In particular, there was a significant decrease in the contact angle of water wetting from 83° to 21°, indicating an increase in the surface energy of the material.
期刊介绍:
Technical Physics Letters is a companion journal to Technical Physics and offers rapid publication of developments in theoretical and experimental physics with potential technological applications. Recent emphasis has included many papers on gas lasers and on lasing in semiconductors, as well as many reports on high Tc superconductivity. The excellent coverage of plasma physics seen in the parent journal, Technical Physics, is also present here with quick communication of developments in theoretical and experimental work in all fields with probable technical applications. Topics covered are basic and applied physics; plasma physics; solid state physics; physical electronics; accelerators; microwave electron devices; holography.