The Adhesive Capacity of Corundum Ceramics Regulated by Low-Pressure CCP Plasma

IF 0.8 4区 物理与天体物理 Q4 PHYSICS, APPLIED
I. K. Nekrasov, I. Sh. Abdullin
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引用次数: 0

Abstract

A comprehensive study was conducted on the effect of plasma treatment under conditions of a high-frequency low-pressure discharge on the physical and mechanical characteristics of technical corundum ceramics. The main goal of the study was to modify the surface and strength properties of the material. It was experimentally determined that plasma treatment significantly improves the key parameters of the material. In particular, there was a significant decrease in the contact angle of water wetting from 83° to 21°, indicating an increase in the surface energy of the material.

Abstract Image

低压CCP等离子体对刚玉陶瓷粘接性能的影响
对高频低压放电条件下等离子体处理对技术刚玉陶瓷物理力学特性的影响进行了全面研究。研究的主要目的是改变材料的表面和强度特性。实验结果表明,等离子体处理显著改善了材料的关键参数。特别是,水润湿接触角从83°明显减小到21°,表明材料的表面能增加。
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来源期刊
Technical Physics Letters
Technical Physics Letters 物理-物理:应用
CiteScore
1.50
自引率
0.00%
发文量
44
审稿时长
2-4 weeks
期刊介绍: Technical Physics Letters is a companion journal to Technical Physics and offers rapid publication of developments in theoretical and experimental physics with potential technological applications. Recent emphasis has included many papers on gas lasers and on lasing in semiconductors, as well as many reports on high Tc superconductivity. The excellent coverage of plasma physics seen in the parent journal, Technical Physics, is also present here with quick communication of developments in theoretical and experimental work in all fields with probable technical applications. Topics covered are basic and applied physics; plasma physics; solid state physics; physical electronics; accelerators; microwave electron devices; holography.
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