Boron Nitride Nanosheets as Prospective Filler for Dielectric Thermally Conductive Elastomeric Films

IF 0.5 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY
N. S. Romanov, E. A. Danilov, I. A. Komarov
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引用次数: 0

Abstract

In the present study, facile and green method for h-BN ultrasonic exfoliation was proposed. Exfoliated hexagonal boron nitride nanosheets characterized via transmission electron microscopy, atomic force microscopy as well as static light scattering, were used as fillers in silicone-based films, which enabled to significantly increase both their in-plane thermal conductivity and anisotropy of thermal properties (increase of 23.9 and 4.8 times, respectively, as compared to pure silicone). Composite films exhibited in-plane and through-plane thermal conductivity of 2.653 and 0.529 W/m K, respectively. At the same time, composites showed excellent electrical insulation properties—high volume resistance (1016 Ohm cm), low permittivity (2.6) and dielectric loss tangent (0.02) at frequencies below 400 kHz.

Abstract Image

氮化硼纳米片作为介电导热弹性体薄膜填料的前景
本研究提出了一种简便、绿色的h-BN超声剥离方法。通过透射电子显微镜、原子力显微镜和静态光散射对脱落的六方氮化硼纳米片进行表征,将其作为硅基薄膜的填料,可以显著提高其面内导热系数和热性能的各向异性(分别比纯硅提高23.9倍和4.8倍)。复合膜的面内导热系数为2.653 W/m K,面内导热系数为0.529 W/m K。同时,复合材料表现出优异的电绝缘性能——在低于400 kHz的频率下,高体积电阻(1016欧姆厘米),低介电常数(2.6)和介电损耗正切(0.02)。
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来源期刊
Inorganic Materials
Inorganic Materials 工程技术-材料科学:综合
CiteScore
1.40
自引率
25.00%
发文量
80
审稿时长
3-6 weeks
期刊介绍: Inorganic Materials is a journal that publishes reviews and original articles devoted to chemistry, physics, and applications of various inorganic materials including high-purity substances and materials. The journal discusses phase equilibria, including P–T–X diagrams, and the fundamentals of inorganic materials science, which determines preparatory conditions for compounds of various compositions with specified deviations from stoichiometry. Inorganic Materials is a multidisciplinary journal covering all classes of inorganic materials. The journal welcomes manuscripts from all countries in the English or Russian language.
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