Mengran Zhou, Wan‐chang Sun, Eryong Liu, Yan Xiao, Yifan Xu, Bo Zhang, Tianze Jia, Hui Cai, Jingli Zhang
{"title":"Effects of multi-component additives on the microstructure and mechanical performance of HVLP copper foil for high-speed electronic devices","authors":"Mengran Zhou, Wan‐chang Sun, Eryong Liu, Yan Xiao, Yifan Xu, Bo Zhang, Tianze Jia, Hui Cai, Jingli Zhang","doi":"10.1007/s10800-024-02255-0","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":506446,"journal":{"name":"Journal of Applied Electrochemistry","volume":"55 6","pages":"1615-1628"},"PeriodicalIF":0.0000,"publicationDate":"2025-02-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Applied Electrochemistry","FirstCategoryId":"0","ListUrlMain":"https://doi.org/10.1007/s10800-024-02255-0","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}