Advances in semiconductor materials and device architectures for biomedical systems: a mini review.

IF 2.8 4区 医学 Q2 ENGINEERING, BIOMEDICAL
Biomedical Engineering Letters Pub Date : 2026-03-31 eCollection Date: 2026-05-01 DOI:10.1007/s13534-026-00573-0
Basharat Hussain, Abid Ullah, Israr Ali, Sheraz Haider, Hyeuk Jin Han, Gangtae Jin
{"title":"Advances in semiconductor materials and device architectures for biomedical systems: a mini review.","authors":"Basharat Hussain, Abid Ullah, Israr Ali, Sheraz Haider, Hyeuk Jin Han, Gangtae Jin","doi":"10.1007/s13534-026-00573-0","DOIUrl":null,"url":null,"abstract":"<p><p>The latest improvements in semiconductor engineering have made it possible for the medical field to take advantage of the new capabilities of sensing, diagnosing, neural modulating, and monitoring therapeutics, among others. The merging of nanomaterials, microfabrication techniques, and flexible electronics have turned the traditional biomedical devices into smart systems that are extremely sensitive and minimally invasive. The article presents a review of the new semiconductor-based technologies in the field of biomedicine, focusing on material innovations, system-level integration, and clinical application pathways. Bio-integrated sensors, neuromodulation platforms, and semiconductor enabled point-of-care diagnostics are the areas that will be discussed during this mini review. A thorough analysis is done on the main challenges like long-term biocompatibility, signal stability in complex biological environments, and scalable manufacturing. Moreover, alternate directions, like soft implantable electronics, AI-integrated semiconductor biosystems, and high-density neural interfaces are discussed as potential future developments. This review is aimed at giving biomedical engineering researchers a clear but thorough view of the continuous reshaping of biomedical engineering by semiconductor innovations.</p>","PeriodicalId":46898,"journal":{"name":"Biomedical Engineering Letters","volume":"16 3","pages":"663-680"},"PeriodicalIF":2.8000,"publicationDate":"2026-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC13129054/pdf/","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Biomedical Engineering Letters","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s13534-026-00573-0","RegionNum":4,"RegionCategory":"医学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/5/1 0:00:00","PubModel":"eCollection","JCR":"Q2","JCRName":"ENGINEERING, BIOMEDICAL","Score":null,"Total":0}
引用次数: 0

Abstract

The latest improvements in semiconductor engineering have made it possible for the medical field to take advantage of the new capabilities of sensing, diagnosing, neural modulating, and monitoring therapeutics, among others. The merging of nanomaterials, microfabrication techniques, and flexible electronics have turned the traditional biomedical devices into smart systems that are extremely sensitive and minimally invasive. The article presents a review of the new semiconductor-based technologies in the field of biomedicine, focusing on material innovations, system-level integration, and clinical application pathways. Bio-integrated sensors, neuromodulation platforms, and semiconductor enabled point-of-care diagnostics are the areas that will be discussed during this mini review. A thorough analysis is done on the main challenges like long-term biocompatibility, signal stability in complex biological environments, and scalable manufacturing. Moreover, alternate directions, like soft implantable electronics, AI-integrated semiconductor biosystems, and high-density neural interfaces are discussed as potential future developments. This review is aimed at giving biomedical engineering researchers a clear but thorough view of the continuous reshaping of biomedical engineering by semiconductor innovations.

生物医学系统中半导体材料和器件架构的进展:综述。
半导体工程的最新进步使医学领域能够利用传感、诊断、神经调节和监测治疗等新能力。纳米材料、微加工技术和柔性电子技术的融合,使传统的生物医学设备变成了极其敏感和微创的智能系统。本文综述了生物医学领域中基于半导体的新技术,重点介绍了材料创新、系统级集成和临床应用途径。生物集成传感器、神经调节平台和半导体支持的即时诊断是本次迷你综述将讨论的领域。深入分析了长期生物相容性、复杂生物环境中的信号稳定性和可扩展制造等主要挑战。此外,备选方向,如软植入式电子、人工智能集成半导体生物系统和高密度神经接口被讨论为潜在的未来发展。这篇综述的目的是让生物医学工程研究人员对半导体创新对生物医学工程的不断重塑有一个清晰而全面的看法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Biomedical Engineering Letters
Biomedical Engineering Letters ENGINEERING, BIOMEDICAL-
CiteScore
6.80
自引率
0.00%
发文量
34
期刊介绍: Biomedical Engineering Letters (BMEL) aims to present the innovative experimental science and technological development in the biomedical field as well as clinical application of new development. The article must contain original biomedical engineering content, defined as development, theoretical analysis, and evaluation/validation of a new technique. BMEL publishes the following types of papers: original articles, review articles, editorials, and letters to the editor. All the papers are reviewed in single-blind fashion.
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