Multi-temperature photoacoustic dynamics in a semiconductor medium with fractional order heat and variable thermal conductivity

IF 3.6 3区 材料科学 Q2 ENGINEERING, MECHANICAL
Amal Al-Hanaya, Wedad Albalawi, Shreen El-Sapa, Khaled Lotfy, Alaa A. El-Bary
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引用次数: 0

Abstract

This paper presents a novel fractional-order photoacoustic model for semiconductor media subjected to laser excitation, formulated within the framework of multi-temperature thermoelasticity and variable thermal conductivity. The proposed model addresses key limitations of classical heat conduction theories by incorporating Caputo fractional time derivatives. Additionally, spatially variable thermal conductivity allows for modeling heterogeneous material properties and realistic thermal gradients. The governing equations couple thermoelastic displacement, thermodynamic and conductive temperature fields, and carrier concentration, capturing the dynamic interactions among thermal, mechanical, and electronic subsystems. Using the normal mode analysis technique allows for analytical and numerical exploration of wave propagation characteristics. Silicon is used as the reference medium in simulations, and results are presented for varying fractional orders and thermal conductivity profiles. The proposed formulation provides a more comprehensive description of memory-dependent thermal transport and coupled thermoelastic–carrier wave propagation in semiconductor materials, offering potential applications in optoelectronic devices, laser-based material diagnostics, and micro-scale thermal management technologies. These findings demonstrate the improved physical accuracy and predictive capabilities of the proposed model, making it highly applicable to modern semiconductor technologies.

具有分数阶热和可变导热系数的半导体介质中的多温度光声动力学
本文提出了一种新的分数阶光声模型,该模型是在多温度热弹性和变导热率的框架下建立的。提出的模型通过结合卡普托分数时间导数解决了经典热传导理论的关键局限性。此外,空间可变导热系数允许建模异质材料的性质和现实的热梯度。控制方程耦合了热弹性位移、热力学和导电温度场以及载流子浓度,捕捉了热、机械和电子子系统之间的动态相互作用。利用正态分析技术可以对波的传播特性进行解析和数值研究。在模拟中采用硅作为参考介质,并给出了不同分数阶和导热系数曲线的结果。提出的公式提供了半导体材料中依赖于记忆的热输运和耦合热弹性载波传播的更全面的描述,为光电器件、基于激光的材料诊断和微尺度热管理技术提供了潜在的应用。这些发现表明,所提出的模型提高了物理精度和预测能力,使其高度适用于现代半导体技术。
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来源期刊
International Journal of Mechanics and Materials in Design
International Journal of Mechanics and Materials in Design ENGINEERING, MECHANICAL-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
6.00
自引率
5.40%
发文量
41
审稿时长
>12 weeks
期刊介绍: It is the objective of this journal to provide an effective medium for the dissemination of recent advances and original works in mechanics and materials'' engineering and their impact on the design process in an integrated, highly focused and coherent format. The goal is to enable mechanical, aeronautical, civil, automotive, biomedical, chemical and nuclear engineers, researchers and scientists to keep abreast of recent developments and exchange ideas on a number of topics relating to the use of mechanics and materials in design. Analytical synopsis of contents: The following non-exhaustive list is considered to be within the scope of the International Journal of Mechanics and Materials in Design: Intelligent Design: Nano-engineering and Nano-science in Design; Smart Materials and Adaptive Structures in Design; Mechanism(s) Design; Design against Failure; Design for Manufacturing; Design of Ultralight Structures; Design for a Clean Environment; Impact and Crashworthiness; Microelectronic Packaging Systems. Advanced Materials in Design: Newly Engineered Materials; Smart Materials and Adaptive Structures; Micromechanical Modelling of Composites; Damage Characterisation of Advanced/Traditional Materials; Alternative Use of Traditional Materials in Design; Functionally Graded Materials; Failure Analysis: Fatigue and Fracture; Multiscale Modelling Concepts and Methodology; Interfaces, interfacial properties and characterisation. Design Analysis and Optimisation: Shape and Topology Optimisation; Structural Optimisation; Optimisation Algorithms in Design; Nonlinear Mechanics in Design; Novel Numerical Tools in Design; Geometric Modelling and CAD Tools in Design; FEM, BEM and Hybrid Methods; Integrated Computer Aided Design; Computational Failure Analysis; Coupled Thermo-Electro-Mechanical Designs.
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