Amal Al-Hanaya, Wedad Albalawi, Shreen El-Sapa, Khaled Lotfy, Alaa A. El-Bary
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引用次数: 0
Abstract
This paper presents a novel fractional-order photoacoustic model for semiconductor media subjected to laser excitation, formulated within the framework of multi-temperature thermoelasticity and variable thermal conductivity. The proposed model addresses key limitations of classical heat conduction theories by incorporating Caputo fractional time derivatives. Additionally, spatially variable thermal conductivity allows for modeling heterogeneous material properties and realistic thermal gradients. The governing equations couple thermoelastic displacement, thermodynamic and conductive temperature fields, and carrier concentration, capturing the dynamic interactions among thermal, mechanical, and electronic subsystems. Using the normal mode analysis technique allows for analytical and numerical exploration of wave propagation characteristics. Silicon is used as the reference medium in simulations, and results are presented for varying fractional orders and thermal conductivity profiles. The proposed formulation provides a more comprehensive description of memory-dependent thermal transport and coupled thermoelastic–carrier wave propagation in semiconductor materials, offering potential applications in optoelectronic devices, laser-based material diagnostics, and micro-scale thermal management technologies. These findings demonstrate the improved physical accuracy and predictive capabilities of the proposed model, making it highly applicable to modern semiconductor technologies.
期刊介绍:
It is the objective of this journal to provide an effective medium for the dissemination of recent advances and original works in mechanics and materials'' engineering and their impact on the design process in an integrated, highly focused and coherent format. The goal is to enable mechanical, aeronautical, civil, automotive, biomedical, chemical and nuclear engineers, researchers and scientists to keep abreast of recent developments and exchange ideas on a number of topics relating to the use of mechanics and materials in design.
Analytical synopsis of contents:
The following non-exhaustive list is considered to be within the scope of the International Journal of Mechanics and Materials in Design:
Intelligent Design:
Nano-engineering and Nano-science in Design;
Smart Materials and Adaptive Structures in Design;
Mechanism(s) Design;
Design against Failure;
Design for Manufacturing;
Design of Ultralight Structures;
Design for a Clean Environment;
Impact and Crashworthiness;
Microelectronic Packaging Systems.
Advanced Materials in Design:
Newly Engineered Materials;
Smart Materials and Adaptive Structures;
Micromechanical Modelling of Composites;
Damage Characterisation of Advanced/Traditional Materials;
Alternative Use of Traditional Materials in Design;
Functionally Graded Materials;
Failure Analysis: Fatigue and Fracture;
Multiscale Modelling Concepts and Methodology;
Interfaces, interfacial properties and characterisation.
Design Analysis and Optimisation:
Shape and Topology Optimisation;
Structural Optimisation;
Optimisation Algorithms in Design;
Nonlinear Mechanics in Design;
Novel Numerical Tools in Design;
Geometric Modelling and CAD Tools in Design;
FEM, BEM and Hybrid Methods;
Integrated Computer Aided Design;
Computational Failure Analysis;
Coupled Thermo-Electro-Mechanical Designs.