Proposal of an Image Processing Method for Enhancing Robustness in Stress Coping Style Classification Using TFI

IF 1 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Kosuke Kuzuma, Tomoro Okajima, Kent Nagumo, Akio Nozawa
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引用次数: 0

Abstract

Human stress coping styles, classified as active or passive, can be distinguished through hemodynamic measurements. However, conventional cuff-based methods are impractical for daily use. Previous studies have explored thermal facial imaging (TFI) as a non-contact alternative and developed classification models for stress coping styles. However, challenges such as facial misalignment and noise from muscle activity have led to a decrease in classification accuracy. This study proposes an image processing method to reduce these sources of noise and enhance model robustness. As a result, our approach improved classification accuracy by approximately 10% compared to conventional methods. © 2025 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.

一种增强TFI应力应对方式分类鲁棒性的图像处理方法的提出
人类的压力应对方式,分为主动或被动,可以通过血液动力学测量来区分。然而,传统的基于袖口的方法不适合日常使用。以往的研究已经探索了热面部成像(TFI)作为非接触的替代方法,并建立了压力应对方式的分类模型。然而,面部错位和肌肉活动噪声等挑战导致分类精度下降。本研究提出一种图像处理方法来减少这些噪声源并增强模型的鲁棒性。结果,与传统方法相比,我们的方法将分类精度提高了大约10%。©2025日本电气工程师协会和Wiley期刊有限责任公司。
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来源期刊
IEEJ Transactions on Electrical and Electronic Engineering
IEEJ Transactions on Electrical and Electronic Engineering 工程技术-工程:电子与电气
CiteScore
2.70
自引率
10.00%
发文量
199
审稿时长
4.3 months
期刊介绍: IEEJ Transactions on Electrical and Electronic Engineering (hereinafter called TEEE ) publishes 6 times per year as an official journal of the Institute of Electrical Engineers of Japan (hereinafter "IEEJ"). This peer-reviewed journal contains original research papers and review articles on the most important and latest technological advances in core areas of Electrical and Electronic Engineering and in related disciplines. The journal also publishes short communications reporting on the results of the latest research activities TEEE ) aims to provide a new forum for IEEJ members in Japan as well as fellow researchers in Electrical and Electronic Engineering from around the world to exchange ideas and research findings.
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