Bending-induced electric potential and carrier concentration redistribution in piezoelectric semiconductor heterostructures

IF 3.6 3区材料科学 Q2 ENGINEERING, MECHANICAL

International Journal of Mechanics and Materials in Design Pub Date : 2026-03-28 DOI:10.1007/s10999-026-09902-8

Zhi Li, CuiYing Fan, MingKai Guo, GuoShuai Qin, Chunsheng Lu, MingHao Zhao

{"title":"Bending-induced electric potential and carrier concentration redistribution in piezoelectric semiconductor heterostructures","authors":"Zhi Li, CuiYing Fan, MingKai Guo, GuoShuai Qin, Chunsheng Lu, MingHao Zhao","doi":"10.1007/s10999-026-09902-8","DOIUrl":null,"url":null,"abstract":"<div><p>Piezoelectric semiconductor (PSC) heterostructures play a significant role in intelligent, miniaturized, and multi-functional integrated systems. However, bending deformation is inevitable during the processing and operation, impacting its accuracy. In this paper, we present a high-fidelity multi-field coupling theoretical method to research the bending-induced electric potential and carrier concentration redistribution. A layer-wise model is adopted to capture material heterogeneity based on the linearized PSC theory, and the governing equations are solved semi-analytically by combining the state-space method with the differential quadrature method. Comprehensive parametric studies are conducted to systematically explore the regulatory mechanism of differences in initial carrier concentrations, aspect ratios, and boundary conditions on the electromechanical coupling behavior. It is shown that bending-induced redistribution of electric potential and carrier concentration in PSC heterostructures significantly deviates from that in homogeneous structures. This coupled behavior provides new physical insights and offers a theoretical basis for the application of PSC heterostructures.</p></div>","PeriodicalId":593,"journal":{"name":"International Journal of Mechanics and Materials in Design","volume":"22 2","pages":""},"PeriodicalIF":3.6000,"publicationDate":"2026-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Mechanics and Materials in Design","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s10999-026-09902-8","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}

引用次数: 0

Abstract

Piezoelectric semiconductor (PSC) heterostructures play a significant role in intelligent, miniaturized, and multi-functional integrated systems. However, bending deformation is inevitable during the processing and operation, impacting its accuracy. In this paper, we present a high-fidelity multi-field coupling theoretical method to research the bending-induced electric potential and carrier concentration redistribution. A layer-wise model is adopted to capture material heterogeneity based on the linearized PSC theory, and the governing equations are solved semi-analytically by combining the state-space method with the differential quadrature method. Comprehensive parametric studies are conducted to systematically explore the regulatory mechanism of differences in initial carrier concentrations, aspect ratios, and boundary conditions on the electromechanical coupling behavior. It is shown that bending-induced redistribution of electric potential and carrier concentration in PSC heterostructures significantly deviates from that in homogeneous structures. This coupled behavior provides new physical insights and offers a theoretical basis for the application of PSC heterostructures.

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压电半导体异质结构中的弯曲诱导电位和载流子浓度重分布

压电半导体异质结构在智能化、小型化、多功能化集成系统中发挥着重要作用。然而，在加工和操作过程中，弯曲变形是不可避免的，影响了其精度。本文提出了一种高保真的多场耦合理论方法来研究弯曲诱导电位和载流子浓度重分布。采用基于线性化PSC理论的分层模型捕捉材料非均质性，并结合状态空间法和微分正交法对控制方程进行半解析求解。通过综合参数研究，系统探索初始载流子浓度、纵横比和边界条件差异对机电耦合行为的调控机制。结果表明，弯曲诱导的PSC异质结构中电势和载流子浓度的重新分布明显不同于均匀结构。这种耦合行为提供了新的物理见解，为PSC异质结构的应用提供了理论基础。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

International Journal of Mechanics and Materials in Design ENGINEERING, MECHANICAL-MATERIALS SCIENCE, MULTIDISCIPLINARY

CiteScore

6.00

自引率

5.40%

发文量

审稿时长

>12 weeks

期刊介绍： It is the objective of this journal to provide an effective medium for the dissemination of recent advances and original works in mechanics and materials'' engineering and their impact on the design process in an integrated, highly focused and coherent format. The goal is to enable mechanical, aeronautical, civil, automotive, biomedical, chemical and nuclear engineers, researchers and scientists to keep abreast of recent developments and exchange ideas on a number of topics relating to the use of mechanics and materials in design. Analytical synopsis of contents: The following non-exhaustive list is considered to be within the scope of the International Journal of Mechanics and Materials in Design: Intelligent Design: Nano-engineering and Nano-science in Design; Smart Materials and Adaptive Structures in Design; Mechanism(s) Design; Design against Failure; Design for Manufacturing; Design of Ultralight Structures; Design for a Clean Environment; Impact and Crashworthiness; Microelectronic Packaging Systems. Advanced Materials in Design: Newly Engineered Materials; Smart Materials and Adaptive Structures; Micromechanical Modelling of Composites; Damage Characterisation of Advanced/Traditional Materials; Alternative Use of Traditional Materials in Design; Functionally Graded Materials; Failure Analysis: Fatigue and Fracture; Multiscale Modelling Concepts and Methodology; Interfaces, interfacial properties and characterisation. Design Analysis and Optimisation: Shape and Topology Optimisation; Structural Optimisation; Optimisation Algorithms in Design; Nonlinear Mechanics in Design; Novel Numerical Tools in Design; Geometric Modelling and CAD Tools in Design; FEM, BEM and Hybrid Methods; Integrated Computer Aided Design; Computational Failure Analysis; Coupled Thermo-Electro-Mechanical Designs.