Nonlocal thermoelastic response of semiconductor media with double porosity under photothermal excitation

IF 3.6 3区 材料科学 Q2 ENGINEERING, MECHANICAL
Gamal M. Ismail, E. S. Elidy, Amr M. S. Mahdy, Ramdan S. Tantawi, Khaled Lotfy
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引用次数: 0

Abstract

In light of the growing importance of micro- and nano-structured semiconductor devices under dynamic photothermal environments, this study presents an analytical investigation of the nonlocal thermoelastic response of a semiconductor medium with a double porosity structure under photothermal excitation, formulated within a two-dimensional framework. The governing equations are established based on Eringen’s nonlocal elasticity theory and the Lord–Shulman generalized thermoelastic model, incorporating two interacting pore networks characteristic of matrix and fracture systems. Using harmonic wave analysis (normal mode technique), the coupled field equations for displacement, temperature, stress, and carrier density are transformed into the frequency domain and solved analytically under laser-induced surface excitation. The resulting solutions reveal the spatial behavior of thermoelastic and photothermal fields, demonstrating significant influences of nonlocality, dual porosity, thermoelastic coupling, and thermoelectric interaction on wave dispersion, stress localization, and heat propagation. This work offers a comprehensive theoretical basis for the design and analysis of advanced porous semiconductor systems in photothermal applications.

光热激励下双孔隙半导体介质的非局部热弹性响应
鉴于微纳米结构半导体器件在动态光热环境下的重要性日益增加,本研究对具有双重孔隙结构的半导体介质在光热激励下的非局部热弹性响应进行了分析研究,并在二维框架内进行了阐述。基于Eringen的非局部弹性理论和Lord-Shulman广义热弹性模型建立了控制方程,考虑了基质和裂缝系统两种相互作用的孔隙网络特征。利用谐波分析(法模技术),将位移、温度、应力和载流子密度耦合场方程转化为频域,在激光诱导表面激励下进行解析求解。结果揭示了热弹性和光热场的空间行为,证明了非定域性、双重孔隙、热弹性耦合和热电相互作用对波色散、应力局部化和热传播的显著影响。这项工作为光热应用中先进多孔半导体系统的设计和分析提供了全面的理论基础。
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来源期刊
International Journal of Mechanics and Materials in Design
International Journal of Mechanics and Materials in Design ENGINEERING, MECHANICAL-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
6.00
自引率
5.40%
发文量
41
审稿时长
>12 weeks
期刊介绍: It is the objective of this journal to provide an effective medium for the dissemination of recent advances and original works in mechanics and materials'' engineering and their impact on the design process in an integrated, highly focused and coherent format. The goal is to enable mechanical, aeronautical, civil, automotive, biomedical, chemical and nuclear engineers, researchers and scientists to keep abreast of recent developments and exchange ideas on a number of topics relating to the use of mechanics and materials in design. Analytical synopsis of contents: The following non-exhaustive list is considered to be within the scope of the International Journal of Mechanics and Materials in Design: Intelligent Design: Nano-engineering and Nano-science in Design; Smart Materials and Adaptive Structures in Design; Mechanism(s) Design; Design against Failure; Design for Manufacturing; Design of Ultralight Structures; Design for a Clean Environment; Impact and Crashworthiness; Microelectronic Packaging Systems. Advanced Materials in Design: Newly Engineered Materials; Smart Materials and Adaptive Structures; Micromechanical Modelling of Composites; Damage Characterisation of Advanced/Traditional Materials; Alternative Use of Traditional Materials in Design; Functionally Graded Materials; Failure Analysis: Fatigue and Fracture; Multiscale Modelling Concepts and Methodology; Interfaces, interfacial properties and characterisation. Design Analysis and Optimisation: Shape and Topology Optimisation; Structural Optimisation; Optimisation Algorithms in Design; Nonlinear Mechanics in Design; Novel Numerical Tools in Design; Geometric Modelling and CAD Tools in Design; FEM, BEM and Hybrid Methods; Integrated Computer Aided Design; Computational Failure Analysis; Coupled Thermo-Electro-Mechanical Designs.
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