Gamal M. Ismail, E. S. Elidy, Amr M. S. Mahdy, Ramdan S. Tantawi, Khaled Lotfy
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引用次数: 0
Abstract
In light of the growing importance of micro- and nano-structured semiconductor devices under dynamic photothermal environments, this study presents an analytical investigation of the nonlocal thermoelastic response of a semiconductor medium with a double porosity structure under photothermal excitation, formulated within a two-dimensional framework. The governing equations are established based on Eringen’s nonlocal elasticity theory and the Lord–Shulman generalized thermoelastic model, incorporating two interacting pore networks characteristic of matrix and fracture systems. Using harmonic wave analysis (normal mode technique), the coupled field equations for displacement, temperature, stress, and carrier density are transformed into the frequency domain and solved analytically under laser-induced surface excitation. The resulting solutions reveal the spatial behavior of thermoelastic and photothermal fields, demonstrating significant influences of nonlocality, dual porosity, thermoelastic coupling, and thermoelectric interaction on wave dispersion, stress localization, and heat propagation. This work offers a comprehensive theoretical basis for the design and analysis of advanced porous semiconductor systems in photothermal applications.
期刊介绍:
It is the objective of this journal to provide an effective medium for the dissemination of recent advances and original works in mechanics and materials'' engineering and their impact on the design process in an integrated, highly focused and coherent format. The goal is to enable mechanical, aeronautical, civil, automotive, biomedical, chemical and nuclear engineers, researchers and scientists to keep abreast of recent developments and exchange ideas on a number of topics relating to the use of mechanics and materials in design.
Analytical synopsis of contents:
The following non-exhaustive list is considered to be within the scope of the International Journal of Mechanics and Materials in Design:
Intelligent Design:
Nano-engineering and Nano-science in Design;
Smart Materials and Adaptive Structures in Design;
Mechanism(s) Design;
Design against Failure;
Design for Manufacturing;
Design of Ultralight Structures;
Design for a Clean Environment;
Impact and Crashworthiness;
Microelectronic Packaging Systems.
Advanced Materials in Design:
Newly Engineered Materials;
Smart Materials and Adaptive Structures;
Micromechanical Modelling of Composites;
Damage Characterisation of Advanced/Traditional Materials;
Alternative Use of Traditional Materials in Design;
Functionally Graded Materials;
Failure Analysis: Fatigue and Fracture;
Multiscale Modelling Concepts and Methodology;
Interfaces, interfacial properties and characterisation.
Design Analysis and Optimisation:
Shape and Topology Optimisation;
Structural Optimisation;
Optimisation Algorithms in Design;
Nonlinear Mechanics in Design;
Novel Numerical Tools in Design;
Geometric Modelling and CAD Tools in Design;
FEM, BEM and Hybrid Methods;
Integrated Computer Aided Design;
Computational Failure Analysis;
Coupled Thermo-Electro-Mechanical Designs.