A. I. Bodyakova, I. S. Zuiko, A. A. Kalinenko, D. Yu. Yuzbekova, E. I. Chistyukhina, R. O. Kaibyshev
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引用次数: 0
Abstract
The effect of solution treatment and aging on the phase composition and physicomechanical properties of an Al-Mg-Si-Cu alloy is investigated. An increase in the solution temperature from 530 to 550°C leads to the hardness increase from 59 ± 1 to 68 ± 2 HV and the electrical conductivity decrease from 38.9 ± 0.1 to 36.0 ± 0.1 % IACS, respectively. The stress–strain curves after solution treatment are characterized by jerky flow or the Portevin–Le Chatelier effect, which is associated with the dissolution of particles at high temperatures and the formation of a supersaturated solid solution in the alloy after solution treatment. Aging at 190°C leads to a nonmonotonic behavior of hardness. The maximum hardness of 143 ± 4 HV is observed after aging for 2 h. The β″, β′, Q′ particles, clusters, and Guinier–Preston zones provide maximum hardness in the alloy. Dispersion hardening leads to an increase in the yield stress and ultimate tensile strength to 340 ± 5 and 390 ± 10 MPa, respectively, at the elongation of about 12.3 ± 1.6%. The high ductility of the alloy (approximately 2% higher than the previously published literature data) may be a result of the absence of needle-like Al5FeSi particles due to a targeted reduction in the Fe concentration in the alloy.
期刊介绍:
The journal provides an international medium for the publication of theoretical and experimental studies and reviews related in the physical mesomechanics and also solid-state physics, mechanics, materials science, geodynamics, non-destructive testing and in a large number of other fields where the physical mesomechanics may be used extensively. Papers dealing with the processing, characterization, structure and physical properties and computational aspects of the mesomechanics of heterogeneous media, fracture mesomechanics, physical mesomechanics of materials, mesomechanics applications for geodynamics and tectonics, mesomechanics of smart materials and materials for electronics, non-destructive testing are viewed as suitable for publication.