{"title":"3D fabrication of complex copper microstructures with path planning by localized electrochemical deposition","authors":"Wenzheng Wu, Xiaojie Tang, Jin-Yu Guo, Jing Wang, Xingbin Zhang, Chenghan Zhao","doi":"10.1007/s10800-024-02181-1","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":506446,"journal":{"name":"Journal of Applied Electrochemistry","volume":"55 2","pages":"439-448"},"PeriodicalIF":0.0000,"publicationDate":"2024-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Applied Electrochemistry","FirstCategoryId":"0","ListUrlMain":"https://doi.org/10.1007/s10800-024-02181-1","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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