Silicone‐Bonded Robust Perovskite Thick Films Integrated onto TFT Arrays for X‐Ray Imaging

Abstract

ABSTRACT Although perovskite thick films are promising candidates for direct X‐ray imaging, their poor thermal shock resistance compromises the structural integrity, leading to cracking and detachment of the thick films. Herein, we employed a silicone binder to achieve robust integration of perovskite thick films onto TFT arrays while ensuring efficient charge transport. The skeletal effect of the silicone binder produced compact films and robust adhesion to the TFT array, increasing the bond strength from 13.73 to 47.61 N. Furthermore, the terminal groups of the silicone effectively passivate defects and elevate charge transport in the perovskites, leading to reduced defect density from 1.29 × 10 11 to 5.92 × 10 10 cm −3 and enhanced carrier mobility‐lifetime (µτ) product from 5.17 × 10 −4 to 1.66 × 10 −3 cm 2 V −1 . The resulting X‐ray detectors demonstrate a remarkably low detection limit of 37.12 nGy air s −1 , and the flat‐panel X‐ray detector achieves a high spatial resolution of 2.8 lp mm −1 , enabling clear and high‐contrast X‐ray imaging.