Xinyi Yu , Haotian Sun , Yuanfu He , Jinmin Peng , Xianping Zeng , Liangshen Chen
{"title":"Robust classification method for printed circuit board defects based on virtual and real space cooperative diffusion model","authors":"Xinyi Yu , Haotian Sun , Yuanfu He , Jinmin Peng , Xianping Zeng , Liangshen Chen","doi":"10.1016/j.engappai.2026.114126","DOIUrl":null,"url":null,"abstract":"<div><div>Printed circuit board defect detection based on deep learning is a key technology in intelligent manufacturing. However, datasets collected in industrial environments often suffer from label noise due to inconsistent expert knowledge and ambiguous defect features, which severely degrades the performance of conventional models. To address this challenge, this paper proposes a robust classification framework based on a virtual-real space collaborative diffusion model. The proposed method introduces a distributed guidance mechanism to construct a latent semantic space (virtual space), which provides probabilistic priors for the inverse diffusion process in the real image space. Furthermore, a parameterized label encoding module is designed to mitigate the loss of fine-grained semantics during forward diffusion, and an attribute interaction attention mechanism is proposed to enhance the modeling of key defect attributes. Extensive experiments on the publicly available dataset with varying levels of label noise demonstrate that our method outperforms state-of-the-art approaches in terms of classification accuracy, robustness, and generated image quality, especially under strong noise conditions.</div></div>","PeriodicalId":50523,"journal":{"name":"Engineering Applications of Artificial Intelligence","volume":"169 ","pages":"Article 114126"},"PeriodicalIF":9.0000,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Engineering Applications of Artificial Intelligence","FirstCategoryId":"94","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0952197626004070","RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/2/7 0:00:00","PubModel":"Epub","JCR":"Q1","JCRName":"AUTOMATION & CONTROL SYSTEMS","Score":null,"Total":0}
引用次数: 0
Abstract
Printed circuit board defect detection based on deep learning is a key technology in intelligent manufacturing. However, datasets collected in industrial environments often suffer from label noise due to inconsistent expert knowledge and ambiguous defect features, which severely degrades the performance of conventional models. To address this challenge, this paper proposes a robust classification framework based on a virtual-real space collaborative diffusion model. The proposed method introduces a distributed guidance mechanism to construct a latent semantic space (virtual space), which provides probabilistic priors for the inverse diffusion process in the real image space. Furthermore, a parameterized label encoding module is designed to mitigate the loss of fine-grained semantics during forward diffusion, and an attribute interaction attention mechanism is proposed to enhance the modeling of key defect attributes. Extensive experiments on the publicly available dataset with varying levels of label noise demonstrate that our method outperforms state-of-the-art approaches in terms of classification accuracy, robustness, and generated image quality, especially under strong noise conditions.
期刊介绍:
Artificial Intelligence (AI) is pivotal in driving the fourth industrial revolution, witnessing remarkable advancements across various machine learning methodologies. AI techniques have become indispensable tools for practicing engineers, enabling them to tackle previously insurmountable challenges. Engineering Applications of Artificial Intelligence serves as a global platform for the swift dissemination of research elucidating the practical application of AI methods across all engineering disciplines. Submitted papers are expected to present novel aspects of AI utilized in real-world engineering applications, validated using publicly available datasets to ensure the replicability of research outcomes. Join us in exploring the transformative potential of AI in engineering.