Bulletin Board: Call for Nominations: 2026 Thomas W. Dakin Distinguished Technical Contributions Award Deadline: January 31, 2026

IF 2 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Electrical Insulation Magazine Pub Date : 2025-10-24 DOI:10.1109/MEI.2025.11217419

引用次数: 0

Abstract

Every two years, the IEEE Dielectrics and Electrical Insulation Society selects an individual for their outstanding, original contributions in advancing the technology of dielectrics and electrical insulation. The DEIS is now seeking nominations for the 2026 Dakin Award. Nominations can be made by submitting an e-mail or letter to Greg Stone by January 31, 2026. Nominations must provide the name of the nominee, his or her CV, why the nominee is worthy of the award, and the proposed citation. The nominator must also indicate at least three people who will endorse the nomination and who will provide their letter of support for the nomination directly to Greg Stone.

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Thomas W. Dakin杰出技术贡献奖截止日期：2026年1月31日

每两年，IEEE介电学和电气绝缘学会都会选出一位在推进介电学和电气绝缘技术方面做出杰出原创性贡献的个人。DEIS目前正在寻求2026年达金奖的提名。提名可以在2026年1月31日之前通过电子邮件或信件提交给格雷格·斯通。提名必须提供被提名人的姓名，他或她的简历，为什么被提名人值得获奖，以及提议的引用。提名者还必须指出至少有三个人将支持提名，并将直接向格雷格·斯通提供支持提名的信。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Electrical Insulation Magazine 工程技术-工程：电子与电气

CiteScore

4.60

自引率

3.40%

发文量

121

审稿时长

>12 weeks

期刊介绍： The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions. Usually three articles are published in each issue. The articles deal with dielectric materials, processes and new developments applied to industry products. Also the EI Magazine is used to promote upcoming conferences and solicits papers for the conferences. In addition, reports on past conferences are given in many issues. Book reviews and news items are included. An editorial is written by both the EIC and the President of DEIS in alternate issues. Advertising of insulation products appears in many issues.