Fabrication of High-Performance Isocyanate-Based Polyimide Films via a Bridging Strategy

IF 5.2 1区化学 Q1 POLYMER SCIENCE

Macromolecules Pub Date : 2025-10-16 DOI:10.1021/acs.macromol.5c00026

Xianzhang Leng, Gaohui Sun, Zuodong Yang, Xinfu Guo, Jun Wang, Rongrong Chen, Shihui Han

引用次数: 0

Abstract

Isocyanate-based polyimide (IBPI) films synthesized using isocyanates and anhydrides as reactive monomers exhibit inferior mechanical performance, limiting their practical applicability. This study introduced 4,4′-oxidianiline (ODA) as a “bridging agent” to connect anhydride-terminated oligomer chain segments generated from diphenylmethane diisocyanate (MDI-50) and 4,4′-oxydiphthalic dianhydride (ODPA). A high-performance IBPI film with high solubility in common organic solvents was obtained via a bridging strategy; this work marked it as PI-X. The mechanical, thermal, and electrical properties of the PI-1.0 film were significantly improved. The tensile strength increased from 54.97 to 108.87 MPa, representing a 98% increase over that of the pure IBPI film. The temperature at 5% weight loss increased from 461 to 524 °C. Meanwhile, the dielectric constant and loss tangent decreased to 2.21 and 0.0047 at 1 kHz, respectively. These excellent performances show that IBPI films have great application prospects in the microelectronics industry.

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通过桥接策略制备高性能异氰酸酯基聚酰亚胺薄膜

以异氰酸酯和酸酐为反应单体合成的异氰酸酯基聚酰亚胺（IBPI）薄膜力学性能较差，限制了其实际应用。本研究引入4,4′-氧化二苯胺（ODA）作为桥接剂，连接二苯基甲烷二异氰酸酯（MDI-50）和4,4′-氧化二苯二酐（ODPA）生成的端酸酐低聚物链段。通过桥接策略获得了在普通有机溶剂中具有高溶解度的高性能IBPI薄膜；这项工作将其标记为PI-X。PI-1.0薄膜的机械性能、热学性能和电学性能均有显著改善。拉伸强度由54.97 MPa提高到108.87 MPa，比纯IBPI膜提高98%。失重5%时，温度从461℃升高到524℃。同时，在1 kHz时介电常数和损耗正切分别降至2.21和0.0047。这些优异的性能表明，IBPI薄膜在微电子工业中具有广阔的应用前景。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Macromolecules 工程技术-高分子科学

CiteScore

9.30

自引率

16.40%

发文量

942

审稿时长

2 months

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