The Correlation between Soda’s Concentration Variation and Annealing Temperatures, Physical and Electrochemical Properties of Oxide Copper Thin Films Processed by Chemical Immersion

IF 0.8 4区 材料科学 Q3 METALLURGY & METALLURGICAL ENGINEERING
Youcef Aouabdia, Nadjah Sobti, Leila Amiour, Mouloud Laidoudi
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Abstract

In this work, we have studied basically, the effect of the variation of the NaOH soda concentration, the influence of annealing temperature variation on the structural, morphological and electrochemical properties of copper oxide obtained by chemical immersion. Initially, we have obtained the nanostructures of copper oxide by chemical immersion into the electrolytes at room temperature with different concentration of NaOH: C1 (2.5 M) and C2 (0.9 M) followed by heat treatments at various temperatures. The main results were obtained by following technics X-ray diffraction (XRD), Raman spectroscopy and scanning electron microscopy (SEM) coupled with an energy-dispersive spectroscopy (EDS) analyzer, this study have shown that the decrease of NaOH concentration decreases the necessary temperature to obtain the Cu2O oxide. The increase of annealing temperature for the two studied electrolytes C1 and C2 influences the crystallinity of obtained layers as well as their microstructures. The current density responses revealed good dark current density values under the most basic conditions. The best value (58.24 mA/cm2) found from the nanostructures which obtained after immersion in the electrolyte C1 followed by treatment at 650°C for 1 h (58.24 mA/cm2) is due to the good crystallinity and to the crystallite size obtained after this annealing (DCuO = 34.08 nm and \({{D}_{{{\text{C}}{{{\text{u}}}_{{\text{2}}}}{\text{O}}}}}\) = 31.04 nm). The good result of current density has also obtained from the samples immersed in C1 then annealed at 180°C for 1 h (43.76 mA/cm2) and at 250°C for 1 h (37.87 mA/cm2) where the CuO layer is solely appeared after these annealing.

Abstract Image

化学浸泡氧化铜薄膜的退火温度、物理和电化学性能与钠浓度变化的关系
在本工作中,我们基本研究了氢氧化钠浓度变化的影响,退火温度的变化对化学浸泡得到的氧化铜的结构、形态和电化学性能的影响。首先,我们在室温下用不同浓度的NaOH: C1 (2.5 M)和C2 (0.9 M)浸泡在电解液中,然后在不同温度下进行热处理,得到了氧化铜的纳米结构。通过x射线衍射(XRD)、拉曼光谱(Raman)和扫描电镜(SEM)结合能谱分析仪(EDS)等技术得到了主要结果。研究表明,NaOH浓度的降低降低了生成氧化Cu2O所需的温度。两种电解质C1和C2的退火温度的升高会影响所得层的结晶度和微观结构。在最基本的条件下,电流密度响应显示出良好的暗电流密度值。在电解液C1中浸泡1小时(58.24 mA/cm2)后得到的纳米结构的最佳值(58.24 mA/cm2)是由于良好的结晶度和退火后得到的晶粒尺寸(DCuO = 34.08 nm和\({{D}_{{{\text{C}}{{{\text{u}}}_{{\text{2}}}}{\text{O}}}}}\) = 31.04 nm)。样品浸在C1中,然后在180°C退火1小时(43.76 mA/cm2)和250°C退火1小时(37.87 mA/cm2)也获得了良好的电流密度结果,退火后CuO层只出现。
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来源期刊
CiteScore
1.90
自引率
18.20%
发文量
90
审稿时长
4-8 weeks
期刊介绍: Protection of Metals and Physical Chemistry of Surfaces is an international peer reviewed journal that publishes articles covering all aspects of the physical chemistry of materials and interfaces in various environments. The journal covers all related problems of modern physical chemistry and materials science, including: physicochemical processes at interfaces; adsorption phenomena; complexing from molecular and supramolecular structures at the interfaces to new substances, materials and coatings; nanoscale and nanostructured materials and coatings, composed and dispersed materials; physicochemical problems of corrosion, degradation and protection; investigation methods for surface and interface systems, processes, structures, materials and coatings. No principe restrictions exist related systems, types of processes, methods of control and study. The journal welcomes conceptual, theoretical, experimental, methodological, instrumental, environmental, and all other possible studies.
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