Dynamic instability analysis of piezoelectric fluid-infiltrated porous metal foam nanosheet considering surface and flexoelectricity effects in hygro-thermal environment

IF 3.6 3区 材料科学 Q2 ENGINEERING, MECHANICAL
Thu Huong Nguyen Thi, Van Ke Tran, Pham Hoang Tu, Pham Hong Thao
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引用次数: 0

Abstract

The main goal of this work is to present the free oscillation, static and dynamic buckling of piezoelectric fluid-infiltrated porous metal foam (FPMF) nanosheet lying on Pasternak medium in the hygro-temperature environment with consideration of the surface and flexoelectricity effects. Employing the nonlocal strain gradient hypothesis in conjunction with refined higher-order shear deformation plate theory (HSDT), the motion equations are derived via Hamilton’s variational principle. The novelty of this study is that the two nonlocal and length-scale coefficients are variable along with thickness, like other material characteristics. Galerkin approach as well as Bolotin’s method are utilized to obtain the dynamic instability region of the piezoelectric FPMF nanosheet. The accuracy of the proposed method is verified through reliable publications. The outcome of this study highlights the significant effects of the nonlocal and length-scale parameters on the vibration and buckling behaviors of piezoelectric FPMF nanosheets. Because it integrates the ideas of nonlocal strain gradient, flexoelectricity, and surface effects for piezoelectric FPMF nanosheets, the current work is broadly applicable. This work clarifies the understanding of the fundamental physics of electromechanical interaction at the piezoelectric FPMF nanosheet, a subject that has not been studied much yet.

湿热环境下考虑表面和挠性电效应的压电流体渗透多孔金属泡沫纳米片的动态失稳分析
本文的主要目的是在考虑表面效应和挠性电效应的情况下,研究压电流体渗透多孔金属泡沫(FPMF)纳米片在高温环境下在帕斯捷尔纳克介质上的自由振荡、静态和动态屈曲。采用非局部应变梯度假设,结合改进的高阶剪切变形板理论(HSDT),利用Hamilton变分原理推导了运动方程。本研究的新颖之处在于,两个非局部和长度尺度系数随厚度而变化,就像其他材料特性一样。利用Galerkin法和Bolotin法获得了压电FPMF纳米片的动态不稳定区域。通过可靠的出版物验证了所提出方法的准确性。本研究结果强调了非局部和长度尺度参数对压电FPMF纳米片的振动和屈曲行为的显著影响。该方法综合了压电FPMF纳米片的非局部应变梯度、柔性电性和表面效应等理论,具有广泛的应用前景。这项工作澄清了对压电FPMF纳米片机电相互作用的基本物理学的理解,这是一个尚未研究的主题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
International Journal of Mechanics and Materials in Design
International Journal of Mechanics and Materials in Design ENGINEERING, MECHANICAL-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
6.00
自引率
5.40%
发文量
41
审稿时长
>12 weeks
期刊介绍: It is the objective of this journal to provide an effective medium for the dissemination of recent advances and original works in mechanics and materials'' engineering and their impact on the design process in an integrated, highly focused and coherent format. The goal is to enable mechanical, aeronautical, civil, automotive, biomedical, chemical and nuclear engineers, researchers and scientists to keep abreast of recent developments and exchange ideas on a number of topics relating to the use of mechanics and materials in design. Analytical synopsis of contents: The following non-exhaustive list is considered to be within the scope of the International Journal of Mechanics and Materials in Design: Intelligent Design: Nano-engineering and Nano-science in Design; Smart Materials and Adaptive Structures in Design; Mechanism(s) Design; Design against Failure; Design for Manufacturing; Design of Ultralight Structures; Design for a Clean Environment; Impact and Crashworthiness; Microelectronic Packaging Systems. Advanced Materials in Design: Newly Engineered Materials; Smart Materials and Adaptive Structures; Micromechanical Modelling of Composites; Damage Characterisation of Advanced/Traditional Materials; Alternative Use of Traditional Materials in Design; Functionally Graded Materials; Failure Analysis: Fatigue and Fracture; Multiscale Modelling Concepts and Methodology; Interfaces, interfacial properties and characterisation. Design Analysis and Optimisation: Shape and Topology Optimisation; Structural Optimisation; Optimisation Algorithms in Design; Nonlinear Mechanics in Design; Novel Numerical Tools in Design; Geometric Modelling and CAD Tools in Design; FEM, BEM and Hybrid Methods; Integrated Computer Aided Design; Computational Failure Analysis; Coupled Thermo-Electro-Mechanical Designs.
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