Investigation into In Situ Computed Tomography Inspection Technology for Conductor Connection Structure of Ultra-High Voltage Gas-Insulated Transmission Lines

IF 0.9 4区材料科学 Q4 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Russian Journal of Nondestructive Testing Pub Date : 2025-07-06 DOI:10.1134/S1061830925600133

Chao Li, Chaohua Wang, Yongfeng Zhao, Hua Zhu, Weihua Shi, Haopeng Li, Ming Luo, Dongtao Zhu, Junli Du

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引用次数: 0

Abstract

The conductor connection structure in gas-insulated transmission lines (GIL) is vital for power grid stability. Traditional inspections require power outages or fault signal detection post-failure, lacking real-time internal structure assessment. This paper introduces an in situ computed Tomography (CT) inspection technology for ultra-high voltage GIL conductors, aiming for non-destructive, high-precision, real-time monitoring. It analyzes Yuyang line GIL’s inspection needs and designs a system with a ring-clamping mechanism and adaptable scanning path. A specialized algorithm tackles incomplete data and imaging accuracy issues unique to GIL. Experiments show the technology’s ability to image GIL conductor connections in three-dimensional (3D), detect defects, and deformations, crucial for GIL’s safe operation and maintenance by identifying and preventing potential failures.

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超高压气体绝缘输电线路导体连接结构现场计算机断层扫描检测技术研究

气体绝缘输电线路的导线连接结构对电网的稳定至关重要。传统的检测需要断电或故障后的故障信号检测，缺乏实时的内部结构评估。介绍了一种超高压GIL导线的原位CT检测技术，旨在实现无损、高精度、实时监测。分析了玉阳线GIL的检测需求，设计了带夹持机构和自适应扫描路径的检测系统。一种专门的算法解决了GIL独有的数据不完整和成像精度问题。实验表明，该技术能够在三维（3D）中对GIL导体连接进行成像，检测缺陷和变形，通过识别和防止潜在故障，对GIL的安全运行和维护至关重要。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Russian Journal of Nondestructive Testing 工程技术-材料科学：表征与测试

CiteScore

1.60

自引率

44.40%

发文量

审稿时长

6-12 weeks

期刊介绍： Russian Journal of Nondestructive Testing, a translation of Defectoskopiya, is a publication of the Russian Academy of Sciences. This publication offers current Russian research on the theory and technology of nondestructive testing of materials and components. It describes laboratory and industrial investigations of devices and instrumentation and provides reviews of new equipment developed for series manufacture. Articles cover all physical methods of nondestructive testing, including magnetic and electrical; ultrasonic; X-ray and Y-ray; capillary; liquid (color luminescence), and radio (for materials of low conductivity).