Hongli Cheng , Yajun Xue , Ming Huang , Bing Zhou , Yuezhan Feng , Liwei Mi , Xianhu Liu , Chuntai Liu
{"title":"Simultaneous in-situ reduction and foaming synthesis of magnetic MXene/rGO porous films for enhanced electromagnetic interference shielding","authors":"Hongli Cheng , Yajun Xue , Ming Huang , Bing Zhou , Yuezhan Feng , Liwei Mi , Xianhu Liu , Chuntai Liu","doi":"10.1016/j.adna.2025.09.004","DOIUrl":null,"url":null,"abstract":"<div><div>Lightweight, porous and conductive films represent a promising solution for effective electromagnetic interference (EMI) shielding. Nevertheless, the simultaneous integration of porous architectures and electromagnetic synergistic components remains a significant challenge. This work presents an innovative fabrication strategy that combines sequential vacuum-assisted filtration with <em>in-situ</em> hydrazine hydrate-mediated foaming. This approach simultaneously constructs a 3D porous architecture while reducing nickel precursors to magnetic nanoparticles, ultimately yielding lightweight MXene/rGO-Ni (fMG-Ni) porous films with tunable electromagnetic properties. The engineered porous architecture facilitates multiple internal reflections and scattering of electromagnetic waves, while the synergistic combination of conductive MXene/rGO and magnetic Ni components induces complementary dielectric and magnetic loss mechanisms. These combined effects endow the porous film with effective EMI shielding properties. The optimized fMG-Ni porous film with an ultralow density of 0.246 g/cm³ and a minimal thickness of 163 μm exhibits an outstanding electrical conductivity of 1062.81 S/m and an EMI shielding effectiveness of 37.9 dB in X-band, achieving a high specific shielding efficiency of 9452 dB·cm²·g⁻¹ and long-term stability (94.3 % retention after 5 months). This work establishes a new paradigm for designing ultralight, high-performance EMI shielding materials for next-generation aerospace, flexible electronics and telecommunication applications.</div></div>","PeriodicalId":100034,"journal":{"name":"Advanced Nanocomposites","volume":"2 ","pages":"Pages 217-226"},"PeriodicalIF":0.0000,"publicationDate":"2025-09-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Nanocomposites","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2949944525000115","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Lightweight, porous and conductive films represent a promising solution for effective electromagnetic interference (EMI) shielding. Nevertheless, the simultaneous integration of porous architectures and electromagnetic synergistic components remains a significant challenge. This work presents an innovative fabrication strategy that combines sequential vacuum-assisted filtration with in-situ hydrazine hydrate-mediated foaming. This approach simultaneously constructs a 3D porous architecture while reducing nickel precursors to magnetic nanoparticles, ultimately yielding lightweight MXene/rGO-Ni (fMG-Ni) porous films with tunable electromagnetic properties. The engineered porous architecture facilitates multiple internal reflections and scattering of electromagnetic waves, while the synergistic combination of conductive MXene/rGO and magnetic Ni components induces complementary dielectric and magnetic loss mechanisms. These combined effects endow the porous film with effective EMI shielding properties. The optimized fMG-Ni porous film with an ultralow density of 0.246 g/cm³ and a minimal thickness of 163 μm exhibits an outstanding electrical conductivity of 1062.81 S/m and an EMI shielding effectiveness of 37.9 dB in X-band, achieving a high specific shielding efficiency of 9452 dB·cm²·g⁻¹ and long-term stability (94.3 % retention after 5 months). This work establishes a new paradigm for designing ultralight, high-performance EMI shielding materials for next-generation aerospace, flexible electronics and telecommunication applications.