The microstructure and mechanical properties of TLP bonding with (SnBiInZn)100-xGax high entropy alloys

IF 4.8 2区 材料科学 Q2 CHEMISTRY, PHYSICAL
Mo Chen , Liang Zhang , Yu-hao Chen , Lei Sun
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引用次数: 0

Abstract

In this experiment, (SnBiInZn)100-xGax (x = 0.5, 1, 2, 4, at.%) high entropy alloys (HEAs) were prepared in a vacuum furnace, and Cu/(SnBiInZn)100-xGax/Cu solder joints for sandwich construction were prepared by transient liquid phase (TLP) bonding at 160 °C. The effects of different Ga content and bonding time on the interface intermetallic compound (IMC) layer and mechanical properties of the joints were investigated. The results showed that when the Ga content was lower than 1 at.%, Ga atoms were almost completely solid-soluted inside the microstructure and did not affect the strength of the joint. Exceeding this critical level led to Ga being firmly incorporated into the IMC layer's surface, impairing the interfacial bonding and triggering an abrupt drop in shear strength. Specifically, when Ga was 0.5 at.%, the IMC layer at the interface thickened progressively with longer bonding durations. After 30 min, the CuZn5 IMC fully transformed into the stable Cu5Zn8 phase, resulting in a shear strength of up to 31.7 MPa. The fracture surface exhibited large honeycomb-like dimples, indicative of a ductile fracture. Successful formation of high-quality joints under low-temperature bonding conditions has been realized. However, when the bonding time was excessively prolonged, the Cu5Zn8 IMC layer grew too thick. Due to the significant difference in Cu and Zn diffusion speeds, Kirkendall voids and cracks formed, ultimately degrading the shear strength of the joint. The soldered joints tended to fracture along the Kirkendall voids at the interface, and the fracture mechanism shifted from ductile to brittle.
TLP与(SnBiInZn)100-xGax高熵合金结合的显微组织和力学性能
在本实验中,(SnBiInZn)100-xGax (x = 0.5, 1,2,4, at。在真空炉中制备了%)高熵合金(HEAs),并在160℃下采用瞬态液相(TLP)键合制备了用于夹层结构的Cu/(SnBiInZn)100-xGax/Cu焊点。研究了不同Ga含量和键合时间对界面金属间化合物(IMC)层和接头力学性能的影响。结果表明,当Ga含量低于1 at时。%, Ga原子几乎完全固溶在组织内部,不影响接头的强度。超过这一临界水平将导致Ga被牢固地结合到IMC层的表面,破坏界面结合并引发抗剪强度的突然下降。具体来说,当Ga = 0.5 at时。%,界面处的IMC层随着键合时间的延长而逐渐增厚。30min后,CuZn5 IMC完全转变为稳定的Cu5Zn8相,抗剪强度高达31.7 MPa。断口表面呈大蜂窝状凹陷,表明韧性断裂。在低温条件下成功地形成了高质量的接头。然而,当键合时间过长时,Cu5Zn8 IMC层变厚。由于Cu和Zn扩散速度的显著差异,形成了Kirkendall空洞和裂纹,最终降低了接头的抗剪强度。焊接接头沿界面处的Kirkendall空洞断裂,断裂机制由韧性向脆性转变。
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来源期刊
Intermetallics
Intermetallics 工程技术-材料科学:综合
CiteScore
7.80
自引率
9.10%
发文量
291
审稿时长
37 days
期刊介绍: This journal is a platform for publishing innovative research and overviews for advancing our understanding of the structure, property, and functionality of complex metallic alloys, including intermetallics, metallic glasses, and high entropy alloys. The journal reports the science and engineering of metallic materials in the following aspects: Theories and experiments which address the relationship between property and structure in all length scales. Physical modeling and numerical simulations which provide a comprehensive understanding of experimental observations. Stimulated methodologies to characterize the structure and chemistry of materials that correlate the properties. Technological applications resulting from the understanding of property-structure relationship in materials. Novel and cutting-edge results warranting rapid communication. The journal also publishes special issues on selected topics and overviews by invitation only.
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