Reduction of thermal conductivity and improved mechanical properties by incorporating high-entropy carbides into p-type Bi0.5Sb1.5Te3 alloy

IF 2.4 4区 物理与天体物理 Q3 PHYSICS, CONDENSED MATTER
Rathinam Vasudevan, Eun-Ha Go, Ji-Won Ha, Soon-Jik Hong
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Abstract

High-entropy alloys have attracted considerable attention in thermoelectrics due to their severe lattice distortions and complex microstructures, which effectively reduce thermal conductivity. In this study, for the first time, high-entropy carbides (HECs) (Hf-Ta-Zr-Ti-Nb)C were introduced into water-atomized p-type Bi0.5Sb1.5Te3 (BST) powder to fabricate BST + x wt% HEC (x = 0, 1, 2, 3) composites via high-energy ball milling, and their microstructural changes, thermoelectric, and mechanical properties were systematically investigated. HEC additions caused a monotonic reduction in particle size, while maintaining the rhombohedral (BiSb)2Te3 phase with minor peak shifts. The carrier effective mass (m∗) increased marginally from 0.9 to 1.0md in BST+2 wt% HEC, accompanied by a minor decrease in power factor (S2σ). On the other hand, BST+3 wt% HEC exhibited a reduced thermal conductivity (κ) of 1.04 W/m. K. at 350 K, attributed to multiple alloy disorder and misfit dislocations at coherent BST-HEC interfaces. Despite it, a large power factor (S2σ) of pristine BST led to a maximum figure of merit, ZTmax of 1.05 at 400 K, with an average ZTavg of 0.87. A higher Vickers hardness of 223 Hv was obtained for BST+3 wt% HEC, attributed to the grain refinement induced by the HEC additions. This study demonstrates that high-entropy carbide doping is a promising strategy for reducing the thermal conductivity in thermoelectric alloys, offering potential for large-scale commercialization.
高熵碳化物对p型Bi0.5Sb1.5Te3合金导热系数的降低和力学性能的改善
高熵合金由于其严重的晶格畸变和复杂的微观结构,有效地降低了热电学领域的热导率,引起了人们的广泛关注。本研究首次将高熵碳化物(HEC) (Hf-Ta-Zr-Ti-Nb)C引入水原子化的p型Bi0.5Sb1.5Te3 (BST)粉末中,采用高能球磨法制备了BST + x wt% HEC (x = 0,1,2,3)复合材料,并对其显微组织变化、热电性能和力学性能进行了系统研究。HEC的加入导致了颗粒尺寸的单调减小,同时保持了菱形(BiSb)2Te3相,峰移较小。在BST+2 wt% HEC中,载流子有效质量(m∗)从0.9 md略微增加到1.0md,同时功率因数(S2σ)略有下降。另一方面,BST+3 wt% HEC的热导率(κ)降低了1.04 W/m。在350 K时,由于BST-HEC界面上的多种合金无序和错配位错。尽管如此,原始BST的大功率因数(S2σ)导致了最大的优点值,400 K时ZTmax为1.05,平均ZTavg为0.87。当BST+3 wt% HEC时,由于HEC的加入导致晶粒细化,合金的维氏硬度达到223 Hv。该研究表明,高熵碳化物掺杂是降低热电合金导热系数的一种很有前途的策略,具有大规模商业化的潜力。
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来源期刊
Solid State Communications
Solid State Communications 物理-物理:凝聚态物理
CiteScore
3.40
自引率
4.80%
发文量
287
审稿时长
51 days
期刊介绍: Solid State Communications is an international medium for the publication of short communications and original research articles on significant developments in condensed matter science, giving scientists immediate access to important, recently completed work. The journal publishes original experimental and theoretical research on the physical and chemical properties of solids and other condensed systems and also on their preparation. The submission of manuscripts reporting research on the basic physics of materials science and devices, as well as of state-of-the-art microstructures and nanostructures, is encouraged. A coherent quantitative treatment emphasizing new physics is expected rather than a simple accumulation of experimental data. Consistent with these aims, the short communications should be kept concise and short, usually not longer than six printed pages. The number of figures and tables should also be kept to a minimum. Solid State Communications now also welcomes original research articles without length restrictions. The Fast-Track section of Solid State Communications is the venue for very rapid publication of short communications on significant developments in condensed matter science. The goal is to offer the broad condensed matter community quick and immediate access to publish recently completed papers in research areas that are rapidly evolving and in which there are developments with great potential impact.
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