Leveraging high-energy X-Ray diffraction microscopy and crystal plasticity simulations to study grain scale stress redistribution within a Ti-7Al sample subjected to creep

IF 5.6 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Saikumar R. Yeratapally , Diwakar Naragani , Paul Shade , Armand Beaudoin , George Weber , Matthew Kasemer , Edward H. Glaessgen
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Abstract

A series of far-field high-energy X-Ray diffraction microscopy (ff-HEDM) measurements gathered at discrete temporal points from the illuminated gage section of a Ti-7Al coupon subjected to creep revealed significant stress relaxation in soft grains neighboring a hard grain. A crystal plasticity finite element (CPFE) framework was used to perform a creep simulation on the tessellated volume of the gage section of the coupon based on the grain centroid data obtained from ff-HEDM. For a contiguous hard and soft grain pair, a correlation was found between grain-average stress relaxation (measured from experiments) and total accumulated slip (estimated from CPFE simulations). However, the magnitude of stress relaxation from CPFE simulation was significantly underpredicted due to the inherent homogeneous nature of the crystal plasticity framework which cannot resolve the mechanisms underpinning events (e.g., intermittent motion of dislocations, slip band formation, precipitate shearing, etc.) leading to stress relaxation in grains.

Abstract Image

利用高能x射线衍射显微镜和晶体塑性模拟研究蠕变下Ti-7Al样品的晶粒尺度应力重新分布
一系列远场高能x射线衍射显微镜(ff-HEDM)测量结果显示,在受蠕变影响的Ti-7Al材料的照射测量截面上,在离散的时间点上,软晶粒与硬晶粒之间存在明显的应力松弛。采用晶体塑性有限元(CPFE)框架,基于ff-HEDM获得的晶粒质心数据,对接头规格截面的镶嵌体进行蠕变模拟。对于连续的硬、软晶粒对,发现晶粒平均应力松弛(实验测量)与总累积滑移(CPFE模拟估计)之间存在相关性。然而,由于晶体塑性框架固有的均匀性,CPFE模拟的应力松弛幅度被严重低估,无法解决导致晶粒应力松弛的基础事件(例如,位错的间歇性运动,滑移带的形成,沉淀剪切等)的机制。
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来源期刊
Scripta Materialia
Scripta Materialia 工程技术-材料科学:综合
CiteScore
11.40
自引率
5.00%
发文量
581
审稿时长
34 days
期刊介绍: Scripta Materialia is a LETTERS journal of Acta Materialia, providing a forum for the rapid publication of short communications on the relationship between the structure and the properties of inorganic materials. The emphasis is on originality rather than incremental research. Short reports on the development of materials with novel or substantially improved properties are also welcomed. Emphasis is on either the functional or mechanical behavior of metals, ceramics and semiconductors at all length scales.
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