The Effect of Stress on the Corrosion Behavior of 7075 Aluminum Alloy After Surface Microporous Copper Plating

Abstract

Regulating the dissolution performance of soluble fracturing tools based on different actual operating conditions of oil and gas wells is of great significance for ensuring the smooth progress of fracturing processes. In response to the current evaluation of the dissolution rate of soluble downhole tool materials, immersion tests and electrochemical measurements under non-stress conditions are usually used, which cannot accurately predict the dissolution rate of soluble downhole tools under stress. Therefore, this paper evaluated the dissolution rate and maximum pit depth of microporous copper coating samples (CPS) in simulated formation water when the loading stress is 0% σ_s, 50% σ_s and 100% σ_s by using a three-point bending fixture, and its dynamic potential polarization curve (PDP), electrochemical impedance spectroscopy (EIS), and cyclic voltammetry curve (CV) were tested. The results show that the uniform corrosion rate and maximum pit depth of CPS increase with the increase of loading stress. When the loading stress is 100% σ_s, both the uniform corrosion rate and the maximum pit depth increased significantly.