Copper-based composite sintering materials and reliability analysis for power electronics packaging

IF 6.8 3区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Journal of Science: Advanced Materials and Devices Pub Date : 2025-08-05 DOI:10.1016/j.jsamd.2025.100963

Xinyue Wang , Zhoudong Yang , Letao Bian , Wenting Liu , Guoqi Zhang , Jing Zhang , Chuantong Chen , Pan Liu

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Abstract

While silver-based sintered materials are limited by cost and electromigration, and copper faces challenges with oxidation at high temperatures, Cu-based composite sintering materials offer promising alternative solutions. This review examines recent advances in Cu-based composite sintered materials for die-attach in power electronics packaging, focusing on their mechanical, thermal, electrical properties, and reliability. This review systematically categorizes such compounding strategies, including direct mixing, core-shell structures, and alloying, analyzing the impact on composite properties. Furthermore, the reliability of Cu-based composite sintered joints is evaluated, addressing high-temperature storage, thermal cycling, corrosion, and electrochemical migration. Challenges such as oxidation resistance, process optimization, and cost-effectiveness are discussed, together with future research directions. This work aims to support researchers in advancing Cu-based composite sintering materials research and development, broadening material options for high-temperature power electronics packaging applications.

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电力电子封装用铜基复合烧结材料及可靠性分析

虽然银基烧结材料受到成本和电迁移的限制，而且铜在高温下面临氧化的挑战，但铜基复合烧结材料提供了有前途的替代解决方案。本文综述了近年来用于电力电子封装的铜基复合烧结材料的研究进展，重点介绍了它们的机械性能、热学性能、电学性能和可靠性。本文对直接混合、核壳结构和合金化等复合策略进行了系统的分类，并分析了对复合材料性能的影响。此外，还评估了cu基复合材料烧结接头的可靠性，包括高温储存、热循环、腐蚀和电化学迁移。讨论了抗氧化性、工艺优化和成本效益等挑战，并展望了未来的研究方向。这项工作旨在支持研究人员推进铜基复合烧结材料的研究和开发，扩大高温电力电子封装应用的材料选择。

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来源期刊

Journal of Science: Advanced Materials and Devices Materials Science-Electronic, Optical and Magnetic Materials

CiteScore

11.90

自引率

2.50%

发文量

审稿时长

47 days

期刊介绍： In 1985, the Journal of Science was founded as a platform for publishing national and international research papers across various disciplines, including natural sciences, technology, social sciences, and humanities. Over the years, the journal has experienced remarkable growth in terms of quality, size, and scope. Today, it encompasses a diverse range of publications dedicated to academic research. Considering the rapid expansion of materials science, we are pleased to introduce the Journal of Science: Advanced Materials and Devices. This new addition to our journal series offers researchers an exciting opportunity to publish their work on all aspects of materials science and technology within the esteemed Journal of Science. With this development, we aim to revolutionize the way research in materials science is expressed and organized, further strengthening our commitment to promoting outstanding research across various scientific and technological fields.