Lead frame surface defect detection based on geometric constraints and adaptive dual-branch normality recall for semiconductor manufacturing

IF 14.2 1区 工程技术 Q1 ENGINEERING, INDUSTRIAL
Tingrui Sun , Zhiwei Li , Xinjie Xiao , Xiangyang Hu , Zhihong Sun
{"title":"Lead frame surface defect detection based on geometric constraints and adaptive dual-branch normality recall for semiconductor manufacturing","authors":"Tingrui Sun ,&nbsp;Zhiwei Li ,&nbsp;Xinjie Xiao ,&nbsp;Xiangyang Hu ,&nbsp;Zhihong Sun","doi":"10.1016/j.jmsy.2025.06.016","DOIUrl":null,"url":null,"abstract":"<div><div>Surface defect detection in lead frames using machine vision is crucial for ensuring the quality and reliability of semiconductor manufacturing. While high-resolution industrial cameras are widely used, detecting tiny defects across hundreds of unit cells remains a significant challenge. Additionally, imbalanced defect data distributions in industrial environments exacerbate the detection challenge. To address these, a novel framework specifically designed for lead frame surface defect detection is proposed. The framework consists of two main components: multi-scale geometric constraint matching (MGCM) and dual-branch attention-based normality recall (DB-ANR). MGCM is a specialized algorithm designed for array-structured detection, efficiently extracting unit cells from high-resolution images by leveraging geometric constraints and eliminating redundant matching points, ensuring stable and precise results. DB-ANR addresses data imbalance and normal pattern forgetting by training on normal data to store patterns, which are recalled during inference to enhance detection accuracy. Additionally, the adaptive local–global dual attention module dynamically balances the contributions of local and global features, enabling robust detection across various defect types. Experiments on a self-constructed dataset with five types of lead frames demonstrate the effectiveness of the proposed framework. MGCM reliably extracts unit cells from high-resolution images, while DB-ANR achieves an AUC of 97.76%, PRO of 89.12%, and F1-score of 81.6%. The model also demonstrates efficient memory usage and fast inference speed, meeting deployment requirements in real industrial scenarios. Furthermore, the proposed array-oriented detection framework is not limited to lead frames and can be extended to other semiconductor applications, such as chip and wafer quality detection, where similar array-structured patterns exist.</div></div>","PeriodicalId":16227,"journal":{"name":"Journal of Manufacturing Systems","volume":"82 ","pages":"Pages 1091-1109"},"PeriodicalIF":14.2000,"publicationDate":"2025-08-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Systems","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0278612525001670","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, INDUSTRIAL","Score":null,"Total":0}
引用次数: 0

Abstract

Surface defect detection in lead frames using machine vision is crucial for ensuring the quality and reliability of semiconductor manufacturing. While high-resolution industrial cameras are widely used, detecting tiny defects across hundreds of unit cells remains a significant challenge. Additionally, imbalanced defect data distributions in industrial environments exacerbate the detection challenge. To address these, a novel framework specifically designed for lead frame surface defect detection is proposed. The framework consists of two main components: multi-scale geometric constraint matching (MGCM) and dual-branch attention-based normality recall (DB-ANR). MGCM is a specialized algorithm designed for array-structured detection, efficiently extracting unit cells from high-resolution images by leveraging geometric constraints and eliminating redundant matching points, ensuring stable and precise results. DB-ANR addresses data imbalance and normal pattern forgetting by training on normal data to store patterns, which are recalled during inference to enhance detection accuracy. Additionally, the adaptive local–global dual attention module dynamically balances the contributions of local and global features, enabling robust detection across various defect types. Experiments on a self-constructed dataset with five types of lead frames demonstrate the effectiveness of the proposed framework. MGCM reliably extracts unit cells from high-resolution images, while DB-ANR achieves an AUC of 97.76%, PRO of 89.12%, and F1-score of 81.6%. The model also demonstrates efficient memory usage and fast inference speed, meeting deployment requirements in real industrial scenarios. Furthermore, the proposed array-oriented detection framework is not limited to lead frames and can be extended to other semiconductor applications, such as chip and wafer quality detection, where similar array-structured patterns exist.
基于几何约束和自适应双支路正态召回的半导体引线框架表面缺陷检测
利用机器视觉检测引线框架的表面缺陷对于确保半导体制造的质量和可靠性至关重要。虽然高分辨率工业相机被广泛使用,但在数百个单位电池中检测微小缺陷仍然是一个重大挑战。此外,工业环境中不平衡的缺陷数据分布加剧了检测挑战。为了解决这些问题,提出了一种专门设计用于引线框架表面缺陷检测的新框架。该框架由两个主要部分组成:多尺度几何约束匹配(MGCM)和基于双分支注意的正态召回(DB-ANR)。MGCM是一种专门为阵列结构检测设计的算法,通过利用几何约束和消除冗余匹配点,有效地从高分辨率图像中提取单元细胞,确保稳定和精确的结果。DB-ANR通过训练正常数据来存储模式来解决数据不平衡和正常模式遗忘问题,这些模式在推理过程中被召回,以提高检测精度。此外,自适应的局部-全局双重注意模块动态地平衡了局部和全局特征的贡献,使得跨各种缺陷类型的健壮检测成为可能。在包含五种引线框架的自构建数据集上进行的实验证明了该框架的有效性。MGCM可靠地提取高分辨率图像中的单位细胞,而DB-ANR的AUC为97.76%,PRO为89.12%,f1评分为81.6%。该模型还证明了高效的内存使用和快速的推理速度,满足实际工业场景的部署要求。此外,所提出的面向阵列的检测框架不仅限于引线框架,而且可以扩展到其他半导体应用,例如芯片和晶圆质量检测,其中存在类似的阵列结构模式。
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来源期刊
Journal of Manufacturing Systems
Journal of Manufacturing Systems 工程技术-工程:工业
CiteScore
23.30
自引率
13.20%
发文量
216
审稿时长
25 days
期刊介绍: The Journal of Manufacturing Systems is dedicated to showcasing cutting-edge fundamental and applied research in manufacturing at the systems level. Encompassing products, equipment, people, information, control, and support functions, manufacturing systems play a pivotal role in the economical and competitive development, production, delivery, and total lifecycle of products, meeting market and societal needs. With a commitment to publishing archival scholarly literature, the journal strives to advance the state of the art in manufacturing systems and foster innovation in crafting efficient, robust, and sustainable manufacturing systems. The focus extends from equipment-level considerations to the broader scope of the extended enterprise. The Journal welcomes research addressing challenges across various scales, including nano, micro, and macro-scale manufacturing, and spanning diverse sectors such as aerospace, automotive, energy, and medical device manufacturing.
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