Simulation and Experimental Study of Ag/Ni Contact Materials

IF 1.1 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Zhang Ying, Wang Jingqin
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引用次数: 0

Abstract

Environmentally friendly and excellent performance of low-voltage electrical contact materials Ag/Ni in recent years for the extensive research and development of cadmium-free silver-based contact materials. However, in the process of using Ag/Ni contact materials have the disadvantage of welding resistance. Doping to improve the performance of Ag/Ni has long been of great interest and has been used in experimental studies, resulting in a waste of many aspects and a lack of theoretical basis. In order to address the above problems, this paper proposes a performance simulation method for W-doped Ag/Ni interface model based on the first principle of density functional theory. The interface models of Ag/Ni(15), Ag/Ni(17) and W-doped Ag/Ni(15), W-doped Ag/Ni(17) are constructed and optimized, and the work of interfacial separation, interfacial energy, density of states, and Mulliken population are obtained and analyzed by energy simulation, and the results show that the interfacial bonding strength and stability of W-doped Ag/Ni materials are enhanced. After that, the W-doped Ag/Ni contact materials were prepared by mechanical alloy process and powder metallurgy, and the consistency between the simulated interface model and the experimentally prepared contact materials was verified by the qualitative analysis of the phase structure of X-ray diffraction experiments. The wettability experimental results are in agreement with the simulation. Therefore, the calculation of interfacial properties by a first-principles approach based on density functional theory can effectively predict the welding resistance of Ag/Ni contact materials. This paper provides a theoretical basis for the development of Ag/Ni contact material properties with excellent performance, which is of great scientific and economic significance for the development of contact materials with excellent performance and green environmental protection. © 2025 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.

Ag/Ni接触材料的模拟与实验研究
环保性能优异的低压电触点材料Ag/Ni近年来得到了广泛的研究和开发的无镉银基触点材料。然而,在使用银/镍触点材料的过程中存在焊阻的缺点。掺杂提高Ag/Ni性能的方法长期以来受到人们的极大关注,并一直用于实验研究,导致很多方面的浪费和缺乏理论依据。为了解决上述问题,本文提出了一种基于密度泛函第一原理的w掺杂Ag/Ni界面模型的性能模拟方法。构建并优化了Ag/Ni(15)、Ag/Ni(17)和w掺杂Ag/Ni(15)、w掺杂Ag/Ni(17)的界面模型,并通过能量模拟得到界面分离功、界面能、态密度和Mulliken居群,结果表明w掺杂Ag/Ni材料的界面结合强度和稳定性得到增强。随后,采用机械合金法和粉末冶金法制备了w掺杂Ag/Ni接触材料,并通过x射线衍射实验相结构的定性分析验证了模拟界面模型与实验制备的接触材料的一致性。润湿性实验结果与模拟结果基本一致。因此,基于密度泛函理论的第一性原理方法计算界面性能可以有效地预测Ag/Ni接触材料的焊接电阻。本文为开发性能优良的Ag/Ni接触材料提供了理论依据,对开发性能优良的绿色环保接触材料具有重要的科学和经济意义。©2025日本电气工程师协会和Wiley期刊有限责任公司。
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来源期刊
IEEJ Transactions on Electrical and Electronic Engineering
IEEJ Transactions on Electrical and Electronic Engineering 工程技术-工程:电子与电气
CiteScore
2.70
自引率
10.00%
发文量
199
审稿时长
4.3 months
期刊介绍: IEEJ Transactions on Electrical and Electronic Engineering (hereinafter called TEEE ) publishes 6 times per year as an official journal of the Institute of Electrical Engineers of Japan (hereinafter "IEEJ"). This peer-reviewed journal contains original research papers and review articles on the most important and latest technological advances in core areas of Electrical and Electronic Engineering and in related disciplines. The journal also publishes short communications reporting on the results of the latest research activities TEEE ) aims to provide a new forum for IEEJ members in Japan as well as fellow researchers in Electrical and Electronic Engineering from around the world to exchange ideas and research findings.
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