Fixtures and workpiece clamping systems in machining

IF 3.6 3区工程技术 Q2 ENGINEERING, INDUSTRIAL

Cirp Annals-Manufacturing Technology Pub Date : 2025-01-01 DOI:10.1016/j.cirp.2025.04.096

Hans-Christian Möhring (2) , Dirk Biermann (1) , Friedrich Bleicher (1) , Shreyes Melkote (1) , Gregor Kappmeyer (3)

引用次数: 0

Abstract

Workpiece clamping systems (WPCS) constitute core elements of machining systems. As part of the force flow and accuracy path, WPCS influence the performance and efficiency of the manufacturing processes. By functional integration, enhanced capability can be introduced to the machining system. Monitoring, active adjustment and process control can be achieved. The layout, design and optimisation of WPCS should be an integrated element in process planning. For this, computer aided support systems are available. Modelling of WPCS enables virtual analyses of process-workpiece-fixture interaction and makes optimisation possible. This paper gives an overview of the technology of WPCS and introduces future perspectives.

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机加工中的夹具和工件夹紧系统

工件夹紧系统（WPCS）是加工系统的核心部件。WPCS作为力流和精度路径的一部分，影响着制造过程的性能和效率。通过功能集成，可以为加工系统引入增强的功能。可实现监控、主动调节和过程控制。WPCS的布局、设计和优化应成为工艺规划的一个综合要素。为此，计算机辅助支持系统是可用的。建模的WPCS使虚拟分析过程-工件-夹具的相互作用，使优化成为可能。本文对WPCS技术进行了综述，并对其发展前景进行了展望。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Cirp Annals-Manufacturing Technology 工程技术-工程：工业

CiteScore

7.50

自引率

9.80%

发文量

137

审稿时长

13.5 months

期刊介绍： CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.