Entangled chip removal utilizing mass-spring model with mobile manipulator

IF 3.2 3区工程技术 Q2 ENGINEERING, INDUSTRIAL

Cirp Annals-Manufacturing Technology Pub Date : 2025-01-01 DOI:10.1016/j.cirp.2025.04.040

Ryuki Takahashi, Hayato Kimura, Yasuhiro Kakinuma (2)

引用次数: 0

Abstract

This study aims to automate the removal of entangled chips in manufacturing environments using a mobile manipulator. Despite advancements in factory automation technology, this task often necessitates manual intervention. Accordingly, this study proposes a deformable chip model (based on a reconfigurable mass-spring system per frame), incorporating visual chip tracking data and force reactions. Consequently, to evaluate the removal state, an efficient removal strategy is derived by defining the instantaneous stiffness and energy absorption rate. Validation of system performance through two removal tests demonstrates the feasibility of automating entangled chip removal, contributing to enhanced operational efficiency in fully automated production lines.

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利用移动机械手质量-弹簧模型去除缠屑

本研究旨在利用移动机械手自动去除制造环境中的纠缠芯片。尽管工厂自动化技术取得了进步，但这项任务往往需要人工干预。因此，本研究提出了一种可变形的芯片模型（基于每帧可重构的质量弹簧系统），结合了视觉芯片跟踪数据和力反应。因此，为了评估去除状态，通过定义瞬时刚度和能量吸收率，推导出有效的去除策略。通过两次去除测试验证了系统性能，证明了自动化去除缠结芯片的可行性，有助于提高全自动生产线的操作效率。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Cirp Annals-Manufacturing Technology 工程技术-工程：工业

CiteScore

7.50

自引率

9.80%

发文量

137

审稿时长

13.5 months

期刊介绍： CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.