Study on field emission characteristics of carbon nanotube arrays patterned via laser welding of dissimilar materials

IF 3.2 3区 工程技术 Q2 ENGINEERING, INDUSTRIAL
Hung-Yin Tsai , Yi-Hung Chen , Kuan-Ching Wang , Paul W. Leu , Ming C. Leu (1)
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引用次数: 0

Abstract

This paper describes a new method of growing carbon nanotube (CNT) arrays using laser welding of a catalyst metal onto the surface of a quartz substrate, followed by CNT growth through the chemical vapor deposition (CVD) process. A major advantage of this method is its ability to pattern the catalyst before growing the CNTs, thus allowing for the formation of CNTs at specific locations. The laser pre-treatment method minimized structural damage to CNTs in comparison to the laser post-processing method, achieving a lower ID/IG value of 0.72 in Raman spectroscopy analysis. Using hexagonally patterned CNT arrays on quartz, we achieve a field emission current density exceeding 1.3 mA/cm2 with a reduced turn-on field of 1.85 V/μm, representing a 25% improvement over filled-line patterns.
不同材料激光焊接碳纳米管阵列的场发射特性研究
本文介绍了一种利用激光将催化剂金属焊接到石英衬底表面,然后通过化学气相沉积(CVD)工艺生长碳纳米管(CNT)阵列的新方法。该方法的一个主要优点是它能够在生长CNTs之前对催化剂进行图案化,从而允许在特定位置形成CNTs。与激光后处理方法相比,激光预处理方法最大限度地减少了CNTs的结构损伤,在拉曼光谱分析中实现了更低的ID/IG值0.72。在石英上使用六角形碳纳米管阵列,我们实现了超过1.3 mA/cm2的场发射电流密度,并且导通场降低到1.85 V/μm,比填充线模式提高了25%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Cirp Annals-Manufacturing Technology
Cirp Annals-Manufacturing Technology 工程技术-工程:工业
CiteScore
7.50
自引率
9.80%
发文量
137
审稿时长
13.5 months
期刊介绍: CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.
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