Enhanced Magnet-aided Laser Induced Plasma Micromachining (E-MLIP) for Expanded Geometric Capabilities

IF 3.2 3区工程技术 Q2 ENGINEERING, INDUSTRIAL

Cirp Annals-Manufacturing Technology Pub Date : 2025-01-01 DOI:10.1016/j.cirp.2025.04.065

Rajiv Malhotra , AnandKumar Patel , Kiarash Naghavi Khanghah , Hongyi Xu

引用次数: 0

Abstract

Laser Induced Plasma Micro Machining (LIPMM) focusses a laser inside a liquid to create plasma that is used for micromachining with superior multi-material capability. This work subjects the plasma to a novel magnetic field to realize atypically simultaneous enhancement of feature resolution, feature depth and Material Removal Rate beyond the limitations of LIPMM and Direct Laser Ablation. A new physics-based model is established to uncover the mechanism behind this enhancement. Further, an acoustics-based approach is created for quantitative in-situ prediction of feature dimensions while considering unknown phenomenological disturbances in the material removal zone, a capability that lies beyond the state-of-the-art.

查看原文本刊更多论文

增强磁辅助激光诱导等离子体微加工（E-MLIP）扩展几何能力

激光诱导等离子体微加工（LIPMM）将激光聚焦在液体中产生等离子体，用于具有优越多材料能力的微加工。这项工作将等离子体置于一个新的磁场中，以实现非典型的同时增强特征分辨率，特征深度和材料去除率，超越了LIPMM和直接激光烧蚀的限制。建立了一个新的基于物理的模型来揭示这种增强背后的机制。此外，一种基于声学的方法被用于定量地原位预测特征尺寸，同时考虑到材料去除区域中未知的现象干扰，这种能力超出了最先进的水平。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Cirp Annals-Manufacturing Technology 工程技术-工程：工业

CiteScore

7.50

自引率

9.80%

发文量

137

审稿时长

13.5 months

期刊介绍： CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.