Segmented 5-axis flank milling: a fast electrical discharge milling strategy for diffuser-shaped film cooling holes

IF 3.2 3区工程技术 Q2 ENGINEERING, INDUSTRIAL

Cirp Annals-Manufacturing Technology Pub Date : 2025-01-01 DOI:10.1016/j.cirp.2025.03.029

Bin Li , Zhuohang Yao , Huanyu Lu , Qiang Gao , Juncheng Lu , Xuecheng Xi , Wansheng Zhao (2)

引用次数: 0

Abstract

This study presents a segmented 5-axis flank milling strategy for fast ED-milling of diffuser-shaped film cooling hole on turbine blades. The proposed method divides the plunge depth into several segments while maintaining flank milling. It combines the benefits of layered fast ED-milling and multi-axis flank fast ED-milling while avoiding complex electrode wear compensation or coarser sidewall surface. The mathematical principles and discretization algorithm for typical ruled surfaces are established to generate 5-axis milling paths for various shaped diffusers. The experimental results demonstrate that the proposed method achieves high geometric accuracy and surface quality, along with significant improvements in machining efficiency.

查看原文本刊更多论文

分段五轴侧面铣削：快速放电铣削策略扩散形膜冷却孔

针对涡轮叶片扩散形气膜冷却孔的快速电铣削，提出了一种分段五轴侧铣削策略。该方法在保持侧铣削的同时，将切削深度分成若干段。它结合了分层快速ed铣削和多轴侧面快速ed铣削的优点，同时避免了复杂的电极磨损补偿或更粗糙的侧壁表面。建立了典型直纹曲面的数学原理和离散化算法，以生成各种形状扩散器的五轴铣削路径。实验结果表明，该方法具有较高的几何精度和表面质量，显著提高了加工效率。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Cirp Annals-Manufacturing Technology 工程技术-工程：工业

CiteScore

7.50

自引率

9.80%

发文量

137

审稿时长

13.5 months

期刊介绍： CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.