Materials removal mechanism in laser-assisted grinding of SiC fibre-reinforced titanium alloy composite

IF 3.2 3区 工程技术 Q2 ENGINEERING, INDUSTRIAL
Dongdong Xu , Tiancheng Ai , Zifu Shen , Shuan Ma , Md Saddam Hossen , Zhirong Liao (2)
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引用次数: 0

Abstract

Silicon carbide fibre-reinforced titanium matrix composites are promising materials for lightweight and high-strength applications. However, their unique properties make them extremely difficult to machine. The present investigation proposes a laser-assisted grinding method to address this challenge and reveals distinct deformation mechanisms of the reinforced SiC fibres and titanium matrix by analysing the monitored machining process, surface properties, subsurface microstructure, and nanoscale deformation characteristics. It achieves improved surface integrity and enhanced machinability, attributed to the softening effect induced by additional thermal loads. This phenomenon transitions the SiC fibres from brittle states to semi-ductile conditions, facilitating fracture and improving overall machinability.
SiC纤维增强钛合金复合材料激光磨削材料去除机理研究
碳化硅纤维增强钛基复合材料是一种具有轻量化和高强度应用前景的材料。然而,它们独特的特性使它们极难加工。本研究提出了一种激光辅助磨削方法来解决这一挑战,并通过分析监测的加工过程、表面性能、地下微观结构和纳米级变形特征,揭示了增强SiC纤维和钛基的不同变形机制。由于额外热载荷引起的软化效应,它可以改善表面完整性和增强可加工性。这种现象将SiC纤维从脆性状态转变为半韧性状态,有利于断裂并提高整体可加工性。
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来源期刊
Cirp Annals-Manufacturing Technology
Cirp Annals-Manufacturing Technology 工程技术-工程:工业
CiteScore
7.50
自引率
9.80%
发文量
137
审稿时长
13.5 months
期刊介绍: CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.
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