Mengchen Yu , Xiao Lin , Lu Yan , Minghao Zhang , Zengqiang Cao , Lubin Huo
{"title":"EMPR equipment development and research on EMPR process of titanium threaded hollow rivets","authors":"Mengchen Yu , Xiao Lin , Lu Yan , Minghao Zhang , Zengqiang Cao , Lubin Huo","doi":"10.1016/j.jmapro.2025.06.099","DOIUrl":null,"url":null,"abstract":"<div><div>To prevent the occurrence of substandard riveting, a handheld electromagnetic pull riveting (EMPR) device is developed based on electromagnetic technology for riveting titanium or titanium alloy rivets in closed/semi-closed structures to achieve high consistency connection quality. Installation process experiments were conducted using the device at different riveting voltages to get the forming conditions of titanium threaded hollow rivets, and the voltage range for forming without riveting defects using flat anvil and right-angle anvil riveting was obtained. Finally, through numerical simulation with ABAQUS and in conjunction with the riveting force waveform obtained through tests, the stress field distribution inside the rivet, and the failure risk area, the relationship between riveting voltage and riveting quality is established. The forming process of the rivet and the reasons for head failure and fracture during the forming process were analyzed. The results indicate that the numerical simulation results correspond well with the experimental results. The device has excellent riveting consistency, just like other types of electromagnetic riveting equipment, and can achieve high-quality single-direction forming in both conditions.</div></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":"150 ","pages":"Pages 1228-1240"},"PeriodicalIF":6.1000,"publicationDate":"2025-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1526612525007571","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
Abstract
To prevent the occurrence of substandard riveting, a handheld electromagnetic pull riveting (EMPR) device is developed based on electromagnetic technology for riveting titanium or titanium alloy rivets in closed/semi-closed structures to achieve high consistency connection quality. Installation process experiments were conducted using the device at different riveting voltages to get the forming conditions of titanium threaded hollow rivets, and the voltage range for forming without riveting defects using flat anvil and right-angle anvil riveting was obtained. Finally, through numerical simulation with ABAQUS and in conjunction with the riveting force waveform obtained through tests, the stress field distribution inside the rivet, and the failure risk area, the relationship between riveting voltage and riveting quality is established. The forming process of the rivet and the reasons for head failure and fracture during the forming process were analyzed. The results indicate that the numerical simulation results correspond well with the experimental results. The device has excellent riveting consistency, just like other types of electromagnetic riveting equipment, and can achieve high-quality single-direction forming in both conditions.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.