Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes

IF 6.8 3区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Junyeol Lee , Hanggyo Jung , Donghyun Jin , Jongwook Jeon
{"title":"Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes","authors":"Junyeol Lee ,&nbsp;Hanggyo Jung ,&nbsp;Donghyun Jin ,&nbsp;Jongwook Jeon","doi":"10.1016/j.jsamd.2025.100931","DOIUrl":null,"url":null,"abstract":"<div><div>This paper explores the design and optimization of multi-Nanosheet Field-Effect Transistors (mNS-FETs) employing a Transition Metal Dichalcogenide (TMDC) channel, specifically MoS<sub>2</sub>, for the 0.7 nm technology node using calibrated Technology Computer-Aided Design (TCAD) simulations. A comprehensive analysis is conducted at both the device and circuit levels, considering various structural parameters such as the number of MoS<sub>2</sub> layers, vertical and lateral nanosheet stacking configurations, and nanosheet widths. To enable more effective structural optimization, the resistance and capacitance components of the device are carefully segmented, providing a detailed framework for design refinements. The results indicate that a trilayer configuration outperforms its monolayer counterpart by reducing external resistance through an increased surface area, making it the preferred option at a 12 nm gate length. This observation also elucidates the advantage of single lateral stacking over double lateral stacking. While vertical stacking increases the effective width for on-current enhancement, excessive stacking compromises switching speed at the same power level, identifying four vertical stack structures as the optimal configuration. Among the evaluated configurations, the trilayer MoS<sub>2</sub> mNS-FET with four vertical stacks, single lateral stacking, and a 17 nm nanosheet width was identified as the optimal structure for the 0.7 nm node. Furthermore, at the circuit level, the effective width is evaluated to ensure compliance with the circuit area constraints of the target technology node. Analyzing the impact of parasitic resistance and capacitance in the Middle-of-Line (MOL) and Back-End-of-Line (BEOL) reveals that time delay can lead to up to a 58 % degradation in inverter circuit performance. By systematically investigating the impact of MoS<sub>2</sub>-based mNS-FET structures, this study provides critical insights to guide the future design of TMDC-based mNS-FETs.</div></div>","PeriodicalId":17219,"journal":{"name":"Journal of Science: Advanced Materials and Devices","volume":"10 3","pages":"Article 100931"},"PeriodicalIF":6.8000,"publicationDate":"2025-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Science: Advanced Materials and Devices","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S246821792500084X","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
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Abstract

This paper explores the design and optimization of multi-Nanosheet Field-Effect Transistors (mNS-FETs) employing a Transition Metal Dichalcogenide (TMDC) channel, specifically MoS2, for the 0.7 nm technology node using calibrated Technology Computer-Aided Design (TCAD) simulations. A comprehensive analysis is conducted at both the device and circuit levels, considering various structural parameters such as the number of MoS2 layers, vertical and lateral nanosheet stacking configurations, and nanosheet widths. To enable more effective structural optimization, the resistance and capacitance components of the device are carefully segmented, providing a detailed framework for design refinements. The results indicate that a trilayer configuration outperforms its monolayer counterpart by reducing external resistance through an increased surface area, making it the preferred option at a 12 nm gate length. This observation also elucidates the advantage of single lateral stacking over double lateral stacking. While vertical stacking increases the effective width for on-current enhancement, excessive stacking compromises switching speed at the same power level, identifying four vertical stack structures as the optimal configuration. Among the evaluated configurations, the trilayer MoS2 mNS-FET with four vertical stacks, single lateral stacking, and a 17 nm nanosheet width was identified as the optimal structure for the 0.7 nm node. Furthermore, at the circuit level, the effective width is evaluated to ensure compliance with the circuit area constraints of the target technology node. Analyzing the impact of parasitic resistance and capacitance in the Middle-of-Line (MOL) and Back-End-of-Line (BEOL) reveals that time delay can lead to up to a 58 % degradation in inverter circuit performance. By systematically investigating the impact of MoS2-based mNS-FET structures, this study provides critical insights to guide the future design of TMDC-based mNS-FETs.
探索亚1nm节点的最佳TMDC多通道GAA-FET架构
本文探讨了多纳米片场效应晶体管(mns - fet)的设计和优化,采用过渡金属二硫化物(TMDC)通道,特别是MoS2,用于0.7 nm技术节点,使用校准技术计算机辅助设计(TCAD)模拟。在器件和电路层面进行了全面的分析,考虑了各种结构参数,如MoS2层数,垂直和横向纳米片堆叠构型以及纳米片宽度。为了实现更有效的结构优化,器件的电阻和电容组件被仔细分割,为设计改进提供了详细的框架。结果表明,三层结构优于单层结构,通过增加表面积减少外部阻力,使其成为12 nm栅极长度的首选。这一观察结果也阐明了单侧叠加优于双侧叠加的优点。虽然垂直堆叠增加了导通电流增强的有效宽度,但过度堆叠会影响相同功率水平下的开关速度,因此确定四种垂直堆叠结构为最佳配置。在评估的结构中,四层垂直堆叠、单层横向堆叠、17 nm纳米片宽度的三层MoS2 mNS-FET被确定为0.7 nm节点的最佳结构。此外,在电路层面,评估有效宽度,以确保符合目标技术节点的电路面积约束。分析了寄生电阻和电容对中线(MOL)和后端线(BEOL)的影响,发现时间延迟会导致逆变器电路性能下降58%。通过系统地研究基于mos2的mNS-FET结构的影响,本研究为指导基于tmdc的mNS-FET的未来设计提供了重要的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Science: Advanced Materials and Devices
Journal of Science: Advanced Materials and Devices Materials Science-Electronic, Optical and Magnetic Materials
CiteScore
11.90
自引率
2.50%
发文量
88
审稿时长
47 days
期刊介绍: In 1985, the Journal of Science was founded as a platform for publishing national and international research papers across various disciplines, including natural sciences, technology, social sciences, and humanities. Over the years, the journal has experienced remarkable growth in terms of quality, size, and scope. Today, it encompasses a diverse range of publications dedicated to academic research. Considering the rapid expansion of materials science, we are pleased to introduce the Journal of Science: Advanced Materials and Devices. This new addition to our journal series offers researchers an exciting opportunity to publish their work on all aspects of materials science and technology within the esteemed Journal of Science. With this development, we aim to revolutionize the way research in materials science is expressed and organized, further strengthening our commitment to promoting outstanding research across various scientific and technological fields.
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