Ruiping Li;Linchang Zhao;Hao Wei;Bocheng OuYang;Bing Fang;Yongchi Xu;Guoqing Hu
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引用次数: 0
Abstract
With the advancement of machine vision, numerous models have been created to detect imperfections in bridges. However, the bulk of these models are designed for single defect detection and are not adept at managing cases with concurrent multiple defects. As a result, quickly recognizing the array of defects on bridge surfaces is still a major obstacle. In response to this challenge, the current research introduces the YOLOv8-CBAM-Wise-IoU model, specifically crafted for the detection of seven distinct bridge surface defect categories. This model integrates the CBAM mechanism for focusing attention and the Wise-IoU for calculating loss, with its effectiveness measured by metrics including accuracy, retrieval rate, F1 measure, and mAP50. Rigorous ablation analyses and benchmarking against both single-tier and multi-tier deep learning frameworks were performed to substantiate the models utility. The YOLOv8-CBAM-Wise-IoU model exhibited formidable performance, recording an accuracy rate of 97.9%, a retrieval rate of 76%, an F1 measure of 58%, an mAP50 of 55.4%, and an mAP50-95 of 32.4%. These results outstrip those of standard models and other ablation variations, emphasizing the models ability to boost the precision and robustness of detecting various defect types on bridge surfaces. Code is available at https://github.com/IamSunday/Enhanced-YOLOv8-for-Detecting-Multiple-Defects-on-Bridge-Surfaces.
期刊介绍:
IEEE Latin America Transactions (IEEE LATAM) is an interdisciplinary journal focused on the dissemination of original and quality research papers / review articles in Spanish and Portuguese of emerging topics in three main areas: Computing, Electric Energy and Electronics. Some of the sub-areas of the journal are, but not limited to: Automatic control, communications, instrumentation, artificial intelligence, power and industrial electronics, fault diagnosis and detection, transportation electrification, internet of things, electrical machines, circuits and systems, biomedicine and biomedical / haptic applications, secure communications, robotics, sensors and actuators, computer networks, smart grids, among others.