Exploring the three-field coupling mechanism of temperature-magnetic stress relief in electrical metal materials

Abstract

This paper presents a comparative investigation into the efficacy of temperature-magnetic stress relief (TMSR) applied to silicon steel, along with an analysis of the ensuing microstructural changes post-TMSR treatment. The findings reveal that TMSR exhibits a remarkable “1 + 1 > 2″ reduction effect. Following TMSR treatment, there is a notable increase in dislocations within the material, accompanied by a rise in parallel domains that are uniformly distributed. Furthermore, density functional theory simulations were conducted on Fe crystals subjected to varying temperature fields to examine changes in crystal properties and elucidate the mechanism behind TMSR’s reduction and enhancement effects. The simulation outcomes indicate a consistent upward trend in crystal atomic magnetic moment with increasing temperature, regardless of stress levels, suggesting a pronounced thermos-magnetic coupling strengthening effect. This phenomenon constitutes the primary mechanism driving the attenuation and enhancement effects observed with TMSR. Additionally, systematic calculations were performed to assess the mechanical properties of the crystal under different temperature conditions. The results demonstrate a continuous softening of the crystal with increasing temperature, eventually leading to a phase change upon surpassing a critical temperature threshold.