Simulation studies of printed circuit board using finite element method to evaluate the potential of cellulose fibres to replace glass fibres Simulationsstudien an Leiterplatten mithilfe der Finite-Elemente-Methode zur Bewertung des Potenzials von Zellulosefasern als Ersatz für Glasfasern

IF 1.2 4区材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materialwissenschaft und Werkstofftechnik Pub Date : 2025-05-21 DOI:10.1002/mawe.202400028

J. C. Velosa, J. M. R. Curto

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引用次数: 0

Abstract

The replacement of glass fibres by cellulose-based fibres in printed circuit board (PCB) is motivated by environmental reasons since the use of biodegradable components from renewable sources will have a significative impact in the life-cycle assessment and sustainability evaluation of these materials. To study the potential of replacement of glass fibres by natural fibres in printed circuit board manufacturing we have used a finite element method (FEM) computational simulation methodology to evaluate the influence of key structural parameters on their thermomechanical properties, with the goal of predicting and quantifying its warpage at soldering process temperatures. In our work some printed circuit board (PCB) configurations have been selected and modelled using different natural fibres and compared with conventional printed circuit board systems, designated by flame retardant epoxy (FR4), that are made from glass fibres, epoxide resin and copper foils. The simulation results indicate that the printed circuit board assembly process, namely the number of layers, has a major influence on the key thermomechanical properties that were studied. Some optimized printed circuit board configurations were selected, based on the simulation studies, and the natural fibres were classified according to their potential to be used in the development of sustainable printed circuit board materials.

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利用有限元法评估纤维素纤维替代玻璃纤维的潜力的印刷电路板模拟研究

印制电路板（PCB）中以纤维素基纤维取代玻璃纤维的动机是出于环境原因，因为使用来自可再生资源的可生物降解成分将对这些材料的生命周期评估和可持续性评价产生重大影响。为了研究天然纤维在印刷电路板制造中取代玻璃纤维的潜力，我们使用有限元法（FEM）计算模拟方法来评估关键结构参数对其热机械性能的影响，目的是预测和量化其在焊接工艺温度下的翘曲。在我们的工作中，我们选择了一些印刷电路板（PCB）的配置，并使用不同的天然纤维进行建模，并与传统的印刷电路板系统进行了比较，这些系统由阻燃环氧树脂（FR4）指定，由玻璃纤维、环氧树脂和铜箔制成。仿真结果表明，印刷电路板的装配工艺，即层数对所研究的关键热机械性能有重要影响。在模拟研究的基础上，选择了一些优化的印刷电路板结构，并根据天然纤维在可持续印刷电路板材料开发中的潜力对其进行了分类。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materialwissenschaft und Werkstofftechnik 工程技术-材料科学：综合

CiteScore

2.10

自引率

9.10%

发文量

154

审稿时长

4-8 weeks

期刊介绍： Materialwissenschaft und Werkstofftechnik provides fundamental and practical information for those concerned with materials development, manufacture, and testing. Both technical and economic aspects are taken into consideration in order to facilitate choice of the material that best suits the purpose at hand. Review articles summarize new developments and offer fresh insight into the various aspects of the discipline. Recent results regarding material selection, use and testing are described in original articles, which also deal with failure treatment and investigation. Abstracts of new publications from other journals as well as lectures presented at meetings and reports about forthcoming events round off the journal.