Effect of annealing treatment on mechanical and tribological properties of FeCrMnAl1·4Cu0.6 high-entropy alloy

IF 4.3 3区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Chemistry and Physics Pub Date : 2025-05-22 DOI:10.1016/j.matchemphys.2025.131074

Li Feng , Xuan Fu , Kai Ma , Yanchun Zhao , Ruilong Liu , Yajun Ling , Xian Zhang

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Abstract

The phase evolution, mechanical properties, and tribological behavior of FeCrMnAl₁_·₄Cu_0.6 high-entropy alloy (HEA) were studied through thermal annealing within the temperature range of 300–1050 °C. Comprehensive characterization using XRD, SEM&EBSD, and property testing revealed microstructural transitions related to temperature. After annealing at 600 °C, the Vickers hardness reached its peak value of 533.6 HV, and the compressive strength reached a peak of 1108 MPa. Annealing at 1050 °C induced the proliferation of the FCC phase, with its volume fraction increasing from 12 % to 55 %, accompanied by grain coarsening mediated by recrystallization. This microstructural evolution led to an increase in the compressive strain rate from 9.2 % to 16 %. Simultaneously, the tribological properties were optimized, with the coefficient of friction decreasing from 0.42 to 0.34, and the wear rate reduced to 6.215 × 10⁻⁶ mm³/(N·m).

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退火处理对FeCrMnAl1·4Cu0.6高熵合金力学和摩擦学性能的影响

研究了FeCrMnAl1·4Cu0.6高熵合金（HEA）在300 ~ 1050℃温度范围内的相演化、力学性能和摩擦学行为。利用XRD， sem&ebsd和性能测试进行综合表征，揭示了与温度相关的微观结构转变。600℃退火后，维氏硬度达到峰值533.6 HV，抗压强度达到峰值1108 MPa。1050℃退火诱导FCC相的增殖，FCC相的体积分数从12%增加到55%，并伴有再结晶介导的晶粒粗化。这种微观组织的演变导致压缩应变率从9.2%增加到16%。同时，优化了摩擦性能，摩擦系数从0.42降低到0.34，磨损率降低到6.215 × 10−6 mm3/（N·m）。

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来源期刊

Materials Chemistry and Physics 工程技术-材料科学：综合

CiteScore

8.70

自引率

4.30%

发文量

1515

审稿时长

69 days

期刊介绍： Materials Chemistry and Physics is devoted to short communications, full-length research papers and feature articles on interrelationships among structure, properties, processing and performance of materials. The Editors welcome manuscripts on thin films, surface and interface science, materials degradation and reliability, metallurgy, semiconductors and optoelectronic materials, fine ceramics, magnetics, superconductors, specialty polymers, nano-materials and composite materials.