On the Constitutive Behavior of Linear Viscoelastic Solids Under the Plane Stress Condition

IF 1.8 3区 工程技术 Q2 ENGINEERING, MULTIDISCIPLINARY
Bojan B. Guzina, Marc Bonnet
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Abstract

Motivated by the recent experimental and analytical developments enabling high-fidelity material characterization of (heterogeneous) sheet-like solid specimens, we seek to elucidate the constitutive behavior of linear viscoelastic solids under the plane stress condition. More specifically, our goal is to expose the relationship between the plane-stress viscoelastic constitutive parameters and their (native) “bulk” counterparts. To facilitate the sought reduction of the three-dimensional (3D) constitutive behavior, we deploy the concept of projection operators and focus on the frequency-domain behavior by resorting to the Fourier transform and the mathematical framework of tempered distributions, which extends the Fourier analysis to functions (common in linear viscoelasticity) for which Fourier integrals are not convergent. In the analysis, our primary focus is the on class of linear viscoelastic solids whose 3D rheological behavior is described by a set of constant-coefficient ordinary differential equations, each corresponding to a generic arrangement of “springs” and “dashpots”. On reducing the general formulation to the isotropic case, we proceed with an in-depth investigation of viscoelastic solids whose bulk and shear modulus each derive from a suite of classical “spring and dashpot” configurations. To enable faithful reconstruction of the 3D constitutive parameters of natural and engineered solids via (i) thin-sheet testing and (ii) applications of the error-in-constitutive-relation approach to the inversion of (kinematic) sensory data, we also examine the reduction of thermodynamic potentials describing linear viscoelasticity under the plane stress condition. The analysis is complemented by a set of analytical and numerical examples, illustrating the effect on the plane stress condition on the behavior of isotropic and anisotropic viscoelastic solids.

平面应力条件下线性粘弹性固体的本构行为研究
由于最近的实验和分析发展使(异质)片状固体样品的高保真材料表征成为可能,我们试图阐明平面应力条件下线性粘弹性固体的本构行为。更具体地说,我们的目标是揭示平面应力粘弹性本构参数与其(原生)“体”对应参数之间的关系。为了方便寻求三维(3D)本构行为的减少,我们部署了投影算子的概念,并通过诉诸傅里叶变换和调质分布的数学框架来关注频域行为,这将傅里叶分析扩展到傅里叶积分不收敛的函数(在线性粘弹性中常见)。在分析中,我们主要关注的是一类线性粘弹性固体,其三维流变行为由一组常系数常微分方程描述,每个常系数常微分方程对应于“弹簧”和“阻尼器”的一般排列。在将一般公式简化为各向同性的情况下,我们继续深入研究粘弹性固体,其体积和剪切模量分别来自一套经典的“弹簧和阻尼器”配置。为了通过(i)薄板测试和(ii)应用本构关系误差方法反演(运动学)感官数据,忠实地重建天然和工程固体的三维本构参数,我们还研究了在平面应力条件下描述线性粘弹性的热力学势的减少。通过一组解析和数值算例,说明了平面应力条件对各向同性和各向异性粘弹性固体行为的影响。
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来源期刊
Journal of Elasticity
Journal of Elasticity 工程技术-材料科学:综合
CiteScore
3.70
自引率
15.00%
发文量
74
审稿时长
>12 weeks
期刊介绍: The Journal of Elasticity was founded in 1971 by Marvin Stippes (1922-1979), with its main purpose being to report original and significant discoveries in elasticity. The Journal has broadened in scope over the years to include original contributions in the physical and mathematical science of solids. The areas of rational mechanics, mechanics of materials, including theories of soft materials, biomechanics, and engineering sciences that contribute to fundamental advancements in understanding and predicting the complex behavior of solids are particularly welcomed. The role of elasticity in all such behavior is well recognized and reporting significant discoveries in elasticity remains important to the Journal, as is its relation to thermal and mass transport, electromagnetism, and chemical reactions. Fundamental research that applies the concepts of physics and elements of applied mathematical science is of particular interest. Original research contributions will appear as either full research papers or research notes. Well-documented historical essays and reviews also are welcomed. Materials that will prove effective in teaching will appear as classroom notes. Computational and/or experimental investigations that emphasize relationships to the modeling of the novel physical behavior of solids at all scales are of interest. Guidance principles for content are to be found in the current interests of the Editorial Board.
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