Controlling debond on demand performance in adhesive systems using structurally tuned expandable graphite fillers

IF 3.8 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
O Kachouri, J Bardon, D Ruch, A Laachachi
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Abstract

The emergence of debonding technologies has enabled adhesive systems to better align with the principles of sustainability and the circular economy by addressing the gap between the end-of-life stage of adhesively bonded products and the potential for component reuse. In this context, the present study explores the application of thermally responsive additives to induce controlled debonding in adhesive joints. In our previous investigations, it was shown that integrating various types of flame retardants (intumescent and non-intumescent) significantly reduced the debonding temperature, by altering the thermomechanical properties of the joint at temperatures substantially lower than the degradation onset of the unmodified adhesive system. Expandable graphite (EG), a thermally responsive material, has previously been employed with success for similar purposes. Its incorporation into the adhesive layer, even in trace amounts, results in a very significant expansion upon the application of heat, thereby providing an effective mechanism for disassembling adhesively bonded structural assemblies. The present study builds on this prior research and probes deeper into the manufacturing processes underlying EG. The primary hypothesis explored is whether tailoring these processes can result in modulating the thermal response of adhesives modified by EG, thereby achieving debonding at distinct temperature ranges suitable for a wide spectrum of applications. This study investigates EG-modified adhesives, assessing their mechanical properties, thermomechanical degradation, and microstructural changes using characterization techniques such as pull-off tests, microtomography, TGA, and DMA. Finally, the recycling potential is demonstrated through the successful reuse of debonded substrates after a simple cleaning process.
用结构调整的可膨胀石墨填料控制粘接系统的按需脱粘性能
脱粘技术的出现,通过解决粘接产品生命周期结束阶段与组件再利用潜力之间的差距,使粘接系统更好地符合可持续性和循环经济原则。在此背景下,本研究探讨了热响应性添加剂在粘合接头中诱导可控脱粘的应用。在我们之前的研究中,我们已经表明,整合各种类型的阻燃剂(膨胀型和非膨胀型)可以显著降低脱粘温度,这是通过改变接头的热机械性能来实现的,其温度大大低于未改性粘合剂系统的降解温度。可膨胀石墨(EG)是一种热响应材料,以前曾成功用于类似目的。将其掺入粘合层,即使是微量的,也会在加热时产生非常显著的膨胀,从而为粘合结构组件的拆卸提供了有效的机制。本研究建立在先前研究的基础上,并深入探讨了EG的制造过程。研究的主要假设是,调整这些过程是否可以调节EG改性胶粘剂的热反应,从而在适合广泛应用的不同温度范围内实现脱粘。本研究研究了eg改性胶粘剂,利用表征技术,如拉伸测试、显微断层扫描、TGA和DMA,评估了它们的机械性能、热机械降解和微观结构变化。最后,通过简单的清洗过程后成功地重复使用脱粘基材,证明了回收潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
7.10
自引率
9.80%
发文量
58
审稿时长
44 days
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