On the mobility of dislocations intersecting {112} free surfaces in Cu

IF 8.3 1区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Ta Duong , Michael J. Demkowicz
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引用次数: 0

Abstract

We perform atomistic simulations to study the motion of edge dislocations intersecting {112} free surfaces in Cu. For dislocations of length > 11 nm, intersections with the free surface exert a drag force that reduces mobility. This force increases with velocity and appears to diverge below the Rayleigh wave speed (cR). New dislocations emitted from the surface effectively prevent the intersections from exceeding cR. For line lengths equal to or below 11 nm, dislocations additionally excite Lamb (bending) waves in the medium. Resonances with these waves generate new subsonic branches in the stress-velocity relation, giving rise to intermittent fluctuations in dislocation velocity at constant imposed strain rate. These findings exhibit qualitative differences to the behavior of dislocations under periodic boundaries, suggesting that experiments measuring mobilities from the displacements of dislocation intersections with free surfaces may not fully represent the behavior of dislocations within crystal interiors, especially at near-sonic velocities and above.

Abstract Image

铜中与{112}自由面相交的位错迁移率
我们进行了原子模拟来研究Cu中与{112}自由表面相交的边缘位错的运动。对于长度≥11nm的位错,与自由表面的交叉处施加阻力,降低迁移率。这种力随着速度的增加而增加,并在瑞利波速(cR)以下出现发散。表面产生的新位错有效地防止了交叉超过cRcR。对于低于11nm的线长,位错会在介质中激发Lamb(弯曲)波。与这些波的共振在应力-速度关系中产生新的亚音速分支,在恒定的施加应变速率下引起位错速度的间歇性波动。这些发现显示了周期性边界下位错行为的定性差异,这表明从位错与自由表面相交的位移测量迁移率的实验可能不能完全代表晶体内部的位错行为,特别是在近声速和更高声速下。
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来源期刊
Acta Materialia
Acta Materialia 工程技术-材料科学:综合
CiteScore
16.10
自引率
8.50%
发文量
801
审稿时长
53 days
期刊介绍: Acta Materialia serves as a platform for publishing full-length, original papers and commissioned overviews that contribute to a profound understanding of the correlation between the processing, structure, and properties of inorganic materials. The journal seeks papers with high impact potential or those that significantly propel the field forward. The scope includes the atomic and molecular arrangements, chemical and electronic structures, and microstructure of materials, focusing on their mechanical or functional behavior across all length scales, including nanostructures.
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